HEAT DISSIPATING FIN, HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME
A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.
1 . A heat dissipating fin comprising:
a heat dissipating portion;
a fixing portion; and
an overflow-proof structure connected between the heat dissipating portion and the fixing portion;
wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion.
2 . The heat dissipating fin of claim 1 , wherein a length of the overflow-proof structure protruded from the fixing portion is between 1 mm and 10 mm.
3 . The heat dissipating fin of claim 1 , further comprising a recess structure formed on the fixing portion.
4 . The heat dissipating fin of claim 3 , further comprising a hook structure formed in the recess structure.
5 . The heat dissipating fin of claim 1 , further comprising a protruding structure protruded from one end of the fixing portion.
6 . The heat dissipating fin of claim 1 , further comprising an extending structure extended from the overflow-proof structure toward the fixing portion.
7 . The heat dissipating fin of claim 6 , wherein the overflow-proof structure and the extending structure are formed as U-shape.
8 . The heat dissipating fin of claim 1 , wherein a thickness of the overflow-proof structure is uniform or varies gradiently.
9 . A heat dissipating device comprising:
a base; and
a plurality of heat dissipating fins, each of the heat dissipating fins comprising:
a heat dissipating portion;
a fixing portion fixed in the base; and
an overflow-proof structure connected between the heat dissipating portion and the fixing portion;
wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion.
10 . The heat dissipating device of claim 9 , wherein each of the heat dissipating fins further comprises a recess structure formed on the fixing portion.
11 . The heat dissipating device of claim 10 , wherein each of the heat dissipating fins further comprises a hook structure formed in the recess structure.
12 . The heat dissipating device of claim 9 , wherein each of the heat dissipating fins further comprises a protruding structure protruded from one end of the fixing portion.
13 . The heat dissipating device of claim 9 , wherein each of the heat dissipating fins further comprises an extending structure extended from the overflow-proof structure toward the fixing portion.
14 . The heat dissipating device of claim 13 , wherein the overflow-proof structure and the extending structure are formed as U-shape.
15 . The heat dissipating device of claim 9 , wherein a thickness of the overflow-proof structure is uniform or varies gradiently.
16 . A method of manufacturing a heat dissipating device comprising:
forming a plurality of heat dissipating fins by a forming process, wherein each of the heat dissipating fins comprises a heat dissipating portion, a fixing portion and an overflow-proof structure, the overflow-proof structure is connected between the heat dissipating portion and the fixing portion, a width of the overflow-proof structure is larger than a width of the heat dissipating portion;
putting the fixing portion of each of the heat dissipating fins into a mold;
pouring a melt metal material into the mold; and
processing the melt metal material by a die casting process so as to form a base, wherein the base covers the fixing portion of each of the heat dissipating fins and the overflow-proof structure of each of the heat dissipating fins prevents the melt metal material from overflowing.
17 . The method of claim 16 , wherein the forming process is an aluminum extrusion process and each of the heat dissipating fins is a flat-type heat dissipating fin, or the forming process is a rivet forming process and each of the heat dissipating fins is a cylinder-type heat dissipating fin.
18 . The method of claim 16 , wherein forming a plurality of heat dissipating fins by a forming process further comprises forming a recess structure on the fixing portion.
19 . The method of claim 16 , wherein forming a plurality of heat dissipating fins by a forming process further comprises forming a protruding structure on the fixing portion and enabling the protruding structure to protrude from one end of the fixing portion.
20 . The method of claim 16 , wherein forming a plurality of heat dissipating fins by a forming process further comprises forming an extending structure on the overflow-proof structure and enabling the extending structure to extend from the overflow-proof structure toward the fixing portion.
21 . The heat dissipating fin of claim 1 , wherein the width of the overflow-proof structure is larger than a width of the fixing portion.
22 . The heat dissipating device of claim 9 , wherein the width of the overflow-proof structure is larger than a width of the fixing portion.
23 . The method of claim 16 , wherein the width of the overflow-proof structure is larger than a width of the fixing portion.