IP Library Granted Patent US 8,592,836
Granted Patent B2
US 8,592,836 · App. 13/331,028 · Granted Nov 26, 2013

Light emitting device and illumination apparatus using same

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Quick Facts
Patent No.
US 8,592,836
App. No.
13/331,028
Granted
Nov 26, 2013
Kind
B2
Abstract

A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof.

Claims (21)

1. A light emitting device, comprising:

a solid light-emitting element;

a mounting substrate mounting the solid light-emitting element thereon;

an encapsulating member encapsulating the solid light-emitting element; and

a lead frame electrically connected to the solid light-emitting element through a wire,

wherein the lead frame is arranged on a rear surface of the mounting substrate, the mounting substrate including a front mounting surface on which the solid light-emitting element is mounted, the front mounting surface having a smooth surface region covered with the encapsulating member; and a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof, and

wherein the lead frame includes a stress-relieving portion bent perpendicularly to a longitudinal direction of the lead frame.

2. The light emitting device of claim 1 , wherein the mounting substrate is formed of a metal plate.

3. The light emitting device of claim 1 , wherein the mounting substrate is configured to serve as a light reflecting member for reflecting light emitted from the solid light-emitting element.

4. The light emitting device of claim 1 , wherein the mounting substrate is formed of a conductive member, and an insulating member is interposed between the mounting substrate and the lead frame.

5. The light emitting device of claim 1 , wherein the mounting surface of the mounting substrate includes a light reflecting portion for reflecting light emitted from the solid light-emitting element.

6. The light emitting device of claim 1 , wherein the encapsulating member is made of a resin material containing a phosphor or a pigment.

7. The light emitting device of claim 1 , further comprising: a diffusing member covering the encapsulating member either directly through an air layer, the mounting surface extending to a portion of the mounting substrate covered by the diffusing member.

8. The light emitting device of claim 7 , wherein the diffusing member is made of a resin material or a sheet-like material containing a phosphor or a pigment.

9. The light emitting device of claim 1 , wherein the lead frame makes contact with the rear surface of the mounting substrate.

10. The light emitting device of claim 1 , wherein the mounting substrate includes an extension portion surrounding the mounting surface.

11. The light emitting device of claim 10 , wherein the extension portion includes a peripheral portion that is bent to the side of the solid light-emitting element.

12. The light emitting device of claim 1 , wherein the lead frame is covered with an insulating member.

13. The light emitting device of claim 1 , wherein the solid light-emitting element is provided in plural, the encapsulating member encapsulating the plural solid light-emitting elements.

14. The light emitting device of claim 13 , wherein the solid light-emitting elements are arranged along a line or in a matrix pattern.

15. An illumination apparatus comprising the light emitting device of claim 1 .

Assignments (2)
MERGER Recorded Mar 14, 2012
From: PANASONIC ELECTRIC WORKS CO.,LTD.
To: PANASONIC CORPORATION
Reel/Frame 027858/0539 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2011
From: YOKOTANI, RYOJI; URANO, YOJI; KUZUHARA, IKKO; TANAKA, KENICHIRO
To: PANASONIC ELECTRIC WORKS CO., LTD.
Reel/Frame 027417/0766 →