Granted Patent B1

US 8,665,566 · App. 13/331,313 · Granted Mar 4, 2014

Abstract

Claims (25)

1. A suspension assembly of a head gimbal assembly for a disk drive, comprising:

a dielectric layer having a first side and a second side opposite the first side;

a conductive layer on the first side of the dielectric layer, the conductive layer comprising a plurality of bond pads at a tail portion of the suspension assembly; and

a structural layer on the second side of the dielectric layer, the structural layer consisting of a plurality of discrete segments positioned within a bonding area and other portions positioned outside of the bonding area, the plurality of discrete segments respectively corresponding in position to the bond pads,

wherein the bonding area extends beyond an area comprising the plurality of discrete segments by a preselected amount, and

wherein the preselected amount is selected such that the plurality of discrete segments are configured to receive a single flat surface without contacting the other portions of the structural layer.

2. The suspension assembly of claim 1 , further comprising a cover layer on the conductive layer, the cover layer having a plurality of openings at locations corresponding to the bond pads.

3. The suspension assembly of claim 1 , wherein the dielectric layer has a plurality of openings respectively corresponding to spaces adjacent to the bond pads.

4. The suspension assembly of claim 1 , wherein the dielectric layer comprises polyimide.

5. The suspension assembly of claim 1 , wherein the conductive layer comprises a plurality of electrically conductive traces connected between the bond pads and a head of the suspension assembly.

6. The suspension assembly of claim 1 , wherein the structural layer comprises a stainless steel layer.

7. A disk drive comprising:

a disk drive base;

a disk rotatably mounted to the disk drive base;

an actuator rotatably mounted to the disk drive base, the actuator comprising a flexible printed circuit (FPC) having a plurality of FPC bond pads; and

at least one head gimbal assembly operatively attached to the actuator, the at least one head gimbal assembly comprising a suspension assembly that comprises:

a dielectric layer having a first side and a second side opposite the first side;

a conductive layer on the first side of the dielectric layer, the conductive layer comprising a plurality of tail bond pads at a tail portion of the suspension assembly, each of the tail bond pads being attached to a corresponding one of the FPC bond pads by a conductive adhesive material; and

a structural layer on the second side of the dielectric layer, the structural layer comprising a plurality of discrete segments positioned within a bonding area and other portions positioned outside of the bonding area, the plurality of discrete segments respectively corresponding in position to the tail bond pads,

wherein the bonding area extends beyond an area comprising the plurality of discrete segments by a preselected amount, and

wherein the preselected amount is selected such that the plurality of discrete segments are configured to receive a single flat surface without contacting the other portions of the structural layer.

8. The disk drive of claim 7 , wherein the conductive adhesive material comprises an anisotropic conductive film (ACF).

9. The disk drive of claim 7 , wherein the dielectric layer has a plurality of openings respectively corresponding to spaces adjacent to the tail bond pads.

10. The disk drive of claim 7 , wherein the suspension assembly further comprises a cover layer on the conductive layer, the cover layer having a plurality of openings at locations corresponding to the tail bond pads.

11. The disk drive of claim 7 , wherein the structural layer comprises a stainless steel layer.

Assignments (7)