Organic light emitting diode display with adhesive layer

1. An organic light emitting diode (OLED) display comprising

a substrate;

an organic light emitting element disposed on the substrate;

an encapsulation substrate disposed on the organic light emitting element; and

an adhesive layer formed between the substrate and the encapsulation substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate,

wherein the adhesive layer is formed by sequentially accumulating:

a) a first filling adhesive layer,

b) a hygroscopic adhesive layer not contacting either of the organic light emitting element or the encapsulation substrate and

c) a second filling adhesive layer;

wherein the adhesive layer includes thermally curable resin or photocurable resin; and

wherein the first filling adhesive layer, the hygroscopic adhesive layer and the second filling adhesive layer include the same kind of thermally curable resin or photocurable resin so that the adhesive layer is formed as one integrated sheet without forming an interface between the layers.

2. The organic light emitting diode (OLED) display of claim 1 , wherein the hygroscopic adhesive layer includes at least one hygroscopic material selected from the group consisting of silica gel (SiO 2 .H 2 O), alumino-silicate beads, montmorillonite, a molecular sieve of zeolite (Na 12 AlO 3 SiO 2 .12H 2 O), activated carbon, alkali metal oxide, alkaline earth metal oxide, metal sulfate, metal halide and metal perchlorate.

3. The organic light emitting diode (OLED) display of claim 1 , wherein the first filling adhesive layer and the second filling adhesive layer independently include at least one filling material selected from the group consisting of talc, silica, magnesium oxide, mica, montmorillonite, alumina, graphite, beryllia (beryllium oxide), aluminum nitride, silicon carbide, mullite and silicon.

4. The organic light emitting diode (OLED) display of claim 2 , wherein the filling material or hygroscopic material has a particle diameter of about 10 nm to about 20 μm.

5. The organic light emitting diode (OLED) display of claim 3 , wherein the filling material or hygroscopic material has a particle diameter of about 10 nm to about 20 μm.

6. The organic light emitting diode (OLED) display of claim 2 , wherein the hygroscopic material or the filling material is mesoporous, plate-shaped, spherical, rod-shaped, fiber-shaped, or core-shell typed.

7. The organic light emitting diode (OLED) display of claim 3 , wherein the hygroscopic material or the filling material is mesoporous, plate-shaped, spherical, rod-shaped, fiber-shaped, or core-shell typed.

8. The organic light emitting diode (OLED) display of claim 1 , wherein the hygroscopic adhesive layer comprises

about 100 parts by weight of thermally curable resin or photocurable resin; and

about 5 to about 50 parts by weight of hygroscopic material.

9. The organic light emitting diode (OLED) display of claim 1 , wherein the first filling adhesive layer and the second filling adhesive layer independently comprise

about 100 parts by weight of thermally curable resin or photocurable resin; and

about 5 to about 50 parts by weight of filling material.

10. The organic light emitting diode (OLED) display of claim 1 , wherein the adhesive layer has a thickness of about 5 μm to about 30 μm.

11. The organic light emitting diode (OLED) display of claim 1 , wherein in the adhesive layer, the thickness ratio of the first filling adhesive layer, hygroscopic adhesive layer and the second filling adhesive layer is about 0.1 to about 1.2:about 0.1 to about 1.2:about 0.1 to about 1.2.