IP Library Granted Patent US 9,236,462
Granted Patent B2
US 9,236,462 · App. 13/334,720 · Granted Jan 12, 2016

Programmable gate III-nitride power transistor

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Quick Facts
Patent No.
US 9,236,462
App. No.
13/334,720
Granted
Jan 12, 2016
Kind
B2
Abstract

A III-nitride semiconductor device which includes a charged floating gate electrode.

Claims (29)

1. A programmable III-Nitride power transistor comprising:

a first III-nitride semiconductor body;

a second III-nitride semiconductor body situated over said first III-nitride semiconductor body to form a two dimensional electron gas;

a passivation layer situated over said second III-nitride semiconductor body;

a gate arrangement disposed over said second III-nitride semiconductor body, said gate arrangement including a non-volatile floating gate situated in a trench within said passivation layer, and a gate electrode situated over said non-volatile floating gate and electrically insulated from said non-volatile floating gate by an insulation spacer in said trench, said non-volatile floating gate configured for programming said III-Nitride power transistor by a current produced in said two dimensional electron gas.

2. The programmable III-Nitride power transistor of claim 1 , wherein a threshold voltage of said programmable III-Nitride power transistor is programmed by said current produced in said two dimensional electron gas.

3. The programmable III-Nitride power transistor of claim 1 further comprising first and second power electrodes coupled to said second III-nitride semiconductor body.

4. The programmable III-Nitride power transistor of claim 1 , wherein said first III-nitride semiconductor body comprises GaN and wherein said second III-nitride semiconductor body comprises AlGaN.

5. The programmable III-Nitride power transistor of claim 1 further comprising a gate insulation body disposed between said non-volatile floating gate and said second III-nitride semiconductor body.

6. The programmable III-Nitride power transistor of claim 5 , wherein said gate insulation body comprises silicon nitride.

7. The programmable III-Nitride power transistor of claim 1 , wherein said non-volatile floating gate is charged to interrupt said two dimensional electron gas.

8. The programmable III-Nitride power transistor of claim 1 further comprising a silicon substrate.

9. The programmable III-Nitride power transistor of claim 1 further comprising a silicon carbide substrate.

10. The programmable III-Nitride power transistor of claim 1 further comprising a sapphire substrate.

11. The programmable III-Nitride power transistor of claim 1 , wherein said non-volatile floating gate is negatively charged.

12. The programmable III-Nitride power transistor of claim 1 , wherein said non-volatile floating gate electrode is rechargeable.

13. A method of fabricating a programmable III-Nitride power transistor, said method comprising:

disposing a first III-nitride semiconductor body over a second III-nitride semiconductor body to form a two dimensional electron gas;

forming a gate insulation body over said second III-nitride semiconductor body;

forming a non-volatile floating gate over said gate insulation body, said non-volatile floating gate situated in a trench within a passivation layer;

disposing a gate electrode over said non-volatile floating gate and electrically insulated from said non-volatile floating gate by an insulation spacer in said trench;

charging said non-volatile floating gate by a current produced in said two dimensional electron gas to obtain a non-volatile charged floating gate electrode.

14. The method of claim 13 , wherein said charging said non-volatile floating gate programs a threshold voltage of said programmable III-Nitride power transistor.

15. The method of claim 13 further comprising disposing first and second power electrodes on said second III-nitride semiconductor body.

16. The method of claim 13 , wherein said first III-nitride semiconductor body comprises GaN and wherein said second III-nitride semiconductor body comprises AlGaN.

17. The method of claim 13 , wherein said gate insulation body comprises silicon nitride.

18. The method of claim 13 , wherein said non-volatile charged floating gate electrode interrupts said two dimensional electron gas.

19. The method of claim 13 , wherein said charging said non-volatile floating gate comprises using a tunneling method.

20. The method of claim 13 , wherein said charging said non-volatile floating gate comprises using hot electron injection.

Assignments (2)
CHANGE OF NAME Recorded Jul 23, 2018
From: INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 046612/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2011
From: BRIERE, MICHAEL A.
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 027436/0278 →