IP Library Granted Patent US 8,724,323
Granted Patent B2
US 8,724,323 · App. 13/337,260 · Granted May 13, 2014

Electronic device with heat dissipation apparatus

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Quick Facts
Patent No.
US 8,724,323
App. No.
13/337,260
Granted
May 13, 2014
Kind
B2
Abstract

A heat dissipation apparatus for an electronic component mounted in a casing of an electronic device includes a first heat sink attached to the component, a second heat sink located outside the casing, and a heat pipe connected between the first heat sink and the second heat sink. The heat pipe contacts the casing.

Claims (9)

1. An electronic device comprising:

a metal casing;

a motherboard mounted in the casing and comprising an electronic component; and

a heat dissipation apparatus comprising a first heat sink thermally attached to the electronic component, a second heat sink located outside the metal casing, and a heat pipe thermally connected between the first heat sink and the second heat sink, wherein the heat pipe thermally contacts the casing;

wherein the metal casing comprises a bottom wall supporting the motherboard, a first end wall extending up from a first end of the bottom wall, and a second end wall extending up from a second end of the bottom wall opposite to the first end wall, the second end wall defines a cutout through which the heat pipe extends;

wherein a supporting piece perpendicularly extends in from the second end wall adjacent to a bottom end of the cutout, the heat dissipation apparatus further comprises a heat-conducting piece supported on the supporting piece, and a heat dissipation piece supported on the heat-conducting piece, the heat pipe is supported on the heat dissipation piece.

2. The electronic device of claim 1 , wherein the first and second end walls each define a plurality of vents, the second heat sink is located at an outer side of the second end wall.

3. The electronic device of claim 1 , wherein the heat pipe comprises a first installing portion mounted to the first heat sink, a second installing portion mounted to the second heat sink, and a connecting portion connected between the first heat sink and the second heat sink.

4. The electronic device of claim 3 , wherein the heat dissipation apparatus further comprises a latching member slidably latched in the cutout, a bottom of the latching member abuts against the connecting portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2018
From: HON HAI PRECISION INDUSTRY CO., LTD.
To: CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.
Reel/Frame 045281/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2011
From: CHANG, YAO-TING; CHAN, HUNG-CHOU
To: HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 027444/0568 →