Stacked micro-channel plate assembly comprising a micro-lens
View Patent ↗A multilayer electronic imaging module and sensor system incorporating a micro-lens layer for imaging and collimating a received image from a field of regard, a photocathode layer for detecting photons from the micro-lens layer and generating an electron output, a micro-channel plate layer for receiving the output electrons emitted from the photocathode in response to the photon input and amplifying same and stacked readout circuitry for processing the electron output of the micro-channel plate. The sensor system of the invention may be provided in the form of a Cassegrain telescope assembly and includes electromagnetic imaging and scanning means and beam-splitting means for directed predetermined ranges of the received image to one or more photo-detector elements which may be in the form of the micro-channel imaging module of the invention.
1. An electronic module comprising a stack of layers wherein the layers comprise:
a micro-lens array layer comprising at least one individual lens element for providing a beam output,
a photocathode layer for generating a photocathode electron output in response to a predetermined range of the electromagnetic spectrum,
a micro-channel plate layer comprising at least one micro-channel for generating a cascaded electron output in response to the photocathode electron output, and,
a readout circuit layer for processing the output of the micro-channel,
the readout circuit layer comprised of a set of readout sub-layers comprising a capacitor top metal and analog preamp sub-layer, a filtering and comparator sub-layer and a digital processing sub-layer.
2. The electronic module of claim 1 wherein the readout circuit layer comprises a first sub-layer and a second sub-layer that are electrically coupled by means of at least one through-silicon via.
3. The electronic module of claim 1 further comprising a thermoelectric cooling layer.
4. The electronic module of claim 1 wherein the beam output of the lens element is collimated.
5. The electronic module of claim 1 wherein the module is disposed in a vacuum environment.
6. The electronic module of claim 1 wherein the module is provided as a pin grid array package.
7. The electronic module of claim 1 wherein the predetermined range of the electromagnetic spectrum comprises a range selected from the ultraviolet, visible, near-infrared, short-wave infrared, medium-wave infrared, long-wave infrared, far-infrared and x-ray ranges of the electromagnetic spectrum.
8. The electronic module of claim 1 wherein the micro-channel plate is comprised of at least one micro-channel having a diameter of less than about 10 microns.
9. The electronic module of claim 1 wherein the micro-channel plate is comprised of at least one micro-channel having a diameter of less than about 5 microns.