Mounting structure and method for dissipating heat from a computer expansion card
View Patent ↗A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.
1. A mounting structure adapted for mounting an expansion card within a computer enclosure and for absorbing and conducting heat from an integrated circuit chip on the expansion card to an ambient atmosphere surrounding the computer enclosure, the mounting structure comprising:
a mounting bracket configured to rigidly support the expansion card within the computer enclosure;
a means for securing the mounting bracket to the computer enclosure;
a heat sink adapted to directly contact a surface of the integrated circuit chip on the expansion card;
an extension interconnecting the heat sink and the mounting bracket, the extension configured for conducting the heat from the heat sink to the mounting bracket; and
a means associated with the mounting bracket for dissipating the heat from the mounting structure directly to the ambient atmosphere surrounding an exterior of the computer enclosure,
wherein the mounting structure is a unitary structure in which the heat sink, the extension, and the mounting bracket comprise a single seamless component rather than individual components assembled together whose surfaces contact each other.
2. The mounting structure of claim 1 , wherein the heat sink and the extension are planar in shape.
3. The mounting structure of claim 1 , wherein a cross-sectional area of the extension is at least one half of a cross-sectional area of the heat sink.
4. The mounting structure of claim 3 , wherein the heat sink, the extension, and the mounting bracket are formed of a material having a thermal conductivity of at least 120 W/mK.
5. The mounting structure of claim 3 , wherein a vast majority of the heat is transferred from the heat sink to the mounting bracket by thermal conductance.
6. The mounting structure of claim 1 , wherein the heat sink and the extension are oriented so as to be substantially parallel to the expansion card when the expansion card is mounted to the mounting structure.
7. In a computer system having an enclosure for mounting an expansion card therein, the computer system comprising a mounting structure mounting the expansion card within the enclosure, the mounting structure comprising:
a mounting bracket secured to the enclosure and configured to rigidly support the expansion card within the enclosure;
a heat sink directly contacting a surface of an integrated circuit chip on the expansion card;
an extension interconnecting the heat sink and the mounting bracket, the extension configured for conducting heat from the heat sink to the mounting bracket; and
a means associated with the mounting bracket for dissipating the heat from the mounting structure directly to the ambient atmosphere surrounding an exterior of the enclosure,
wherein the mounting structure is a unitary structure in which the heat sink, the extension, and the mounting bracket comprise a single seamless component rather than individual components assembled together whose surfaces contact each other.
8. The computer system of claim 7 , wherein the heat sink and the extension are planar in shape.
9. The computer system of claim 7 , wherein a cross-sectional area of the extension is at least one half of a cross-sectional area of the heat sink.
10. The computer system of claim 9 , wherein the heat sink, the extension, and the mounting bracket are formed of a material having a thermal conductivity of at least 120 W/mK.
11. The computer system of claim 9 , wherein a vast majority of the heat is transferred from the heat sink to the mounting bracket by thermal conductance.
12. The computer system of claim 7 , wherein the heat sink and the extension are oriented so as to be substantially parallel to the expansion card mounted to the mounting structure.
13. A method of mounting an expansion card within a computer enclosure and for absorbing and conducting heat from an integrated circuit chip on the expansion card to an ambient atmosphere surrounding the computer enclosure, the method comprising:
securing the expansion card to the mounting bracket so that a heat sink extending from the mounting bracket directly contacts a surface of the integrated circuit chip;
securing the mounting bracket to the computer enclosure, the mounting bracket rigidly supporting the expansion card within the computer enclosure;
conducting the heat from the heat sink to the mounting bracket; and
dissipating the heat from the mounting structure directly to the ambient atmosphere surrounding an exterior of the computer enclosure,
wherein the mounting bracket, the heat sink, and an extension therebetween is a unitary structure comprising a single seamless component rather than individual components assembled together whose surfaces contact each other.
14. The method of claim 13 , wherein a vast majority of the heat is transferred from the heat sink to the mounting bracket by thermal conductance.