Acoustic filter and method of acoustic filter manufacture

1. An acoustic filter comprising:

a plurality of series acoustic resonators coupled in series on a first resonator substrate;

a plurality of shunt resonators on a second resonator substrate, wherein one of the first and second resonator substrates is quartz with a first cut angle, and the other of the first and second resonator substrates is quartz with a second cut angle;

a support substrate, wherein the first and second resonator substrates are mounted on the support substrate; and

a plurality of electrical connections, wherein each respective electrical connection electrically couples a respective one of the plurality of shunt resonators to a respective one of the plurality of series acoustic resonators.

2. The acoustic filter of claim 1 , wherein the plurality of series acoustic resonators are surface acoustic wave resonators.

3. The acoustic filter of claim 1 , wherein the plurality of series acoustic resonators are bulk acoustic wave resonators.

4. The acoustic filter of claim 1 , wherein the plurality of shunt resonators are surface acoustic wave resonators.

5. The acoustic filter of claim 1 , wherein the plurality of shunt resonators are bulk acoustic wave resonators.

6. The acoustic filter of claim 1 , wherein the plurality of shunt resonators are inductor-capacitor (LC) wave resonators.

7. The acoustic filter of claim 1 , wherein the support substrate is formed from at least one of a ceramic material or an insulating laminate.

8. The acoustic filter of claim 1 , wherein the series acoustic resonators and shunt resonators are at least partially formed from different materials from each other.

9. The acoustic filter of claim 1 , wherein the first and second cut angles are each selected from the group consisting of: AT-cut, ST-cut, Y-cut, and rotated Y-cut.

10. The acoustic filter of claim 1 , wherein the support substrate is a printed circuit board.

11. The acoustic filter of claim 1 , wherein each of the plurality of electrical connections comprises a wirebond connection.

12. The acoustic filter of claim 1 , wherein each of the plurality of electrical connections comprises a solder ball connection.

13. The acoustic filter of claim 1 , wherein the plurality of shunt resonators are tunable resonators.

14. The acoustic filter of claim 13 , wherein the tunable resonators each comprise a varactor.

15. The acoustic filter of claim 14 , wherein the tunable resonators each further comprise a tunable inductor.

16. A method of fabricating an acoustic filter, the method comprising:

forming a plurality of series acoustic resonators coupled in series on a first resonator substrate;

forming a plurality of shunt resonators on a second resonator substrate, wherein one of the first and second resonator substrates is quartz with a first cut angle, and the other of the first and second resonator substrates is quartz with a second cut angle;

mounting the first and second resonator substrates on a support substrate; and

electrically coupling each of the plurality of shunt resonators to a respective one of the plurality of series acoustic resonators.

17. The method of claim 16 , wherein the plurality of series acoustic resonators are all surface acoustic wave resonators or all bulk acoustic wave resonators, and wherein the plurality of shunt resonators are all surface acoustic wave resonators or all bulk acoustic wave resonators.

18. The method of claim 16 , wherein the first and second cut angles are each selected from the group consisting of: AT-cut, ST-cut, Y-cut, and rotated Y-cut.

19. The method of claim 16 , wherein the electrically coupling comprises wire bonding a respective contact pad of each of the plurality of shunt resonators to a respective contact pad of the respective one of the plurality of series acoustic resonators.

20. The method of claim 19 , wherein the mounting of the first and second resonator substrates further comprises placing the respective contact pad of each of the plurality of shunt resonators adjacent to a respective contact pad of the respective one of the plurality of series acoustic resonators.

21. A wireless communication device comprising:

an antenna;

an antenna duplexer coupled to an antenna;

a mixer; and

an input amplifier and an acoustic filter coupled between the antenna duplexer and the mixer, wherein the acoustic filter comprises a first resonator substrate comprising a plurality of series acoustic resonators, and a second resonator substrate comprising a plurality of shunt resonators, wherein one of the first and second resonator substrates is quartz with a first cut angle, and the other of the first and second resonator substrates is quartz with a second cut angle, and wherein each of the plurality of shunt resonators is electrically coupled to a respective one of the plurality of series acoustic resonators.

22. The wireless communication device of claim 21 , wherein the plurality of series acoustic resonators are all surface acoustic wave resonators or all bulk acoustic wave resonators, and wherein the plurality of shunt resonators are all surface acoustic wave resonators or all bulk acoustic wave resonators.

23. The wireless communication device of claim 21 , wherein the first and second cut angles are each selected from the group consisting of: AT-cut, ST-cut, Y-cut, and rotated Y-cut.

24. The wireless communication device of claim 21 , wherein an input of the input amplifier is coupled to the antenna duplexer, wherein an output of the input amplifier is coupled to an input of the acoustic filter, and wherein an output of the acoustic filter is coupled to an input of the mixer.

25. The wireless communication device of claim 21 , wherein an input of the acoustic filter is coupled to the antenna duplexer, wherein an output of the acoustic filter is coupled to an input of the input amplifier, and wherein an output of the input amplifier is coupled to an input of the mixer.