IP Library Patent Application 13340757
Patent Application
App. No. 13/340,757

MANUFACTURING METHOD OF COMPOSITE POLY-SILICON SUBSTRATE OF SOLAR CELL

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Patent No.
US None
App. No.
13/340,757
Abstract

A manufacturing method of a composite poly-silicon substrate of solar cells includes the following steps: providing a first substrate layer having a purity ranging from 2N to 3N; and forming a second substrate layer on the first substrate layer, where the purity of the second substrate layer ranges from 6N to 9N.

Claims (12)

1 . A manufacturing method of a composite poly-silicon substrate of solar cells, comprising the steps of:

providing a first substrate layer having a purity ranging from 2N to 3N; and

forming a second substrate layer on the first substrate layer, wherein the purity of the second substrate layer ranges from 6N to 9N.

2 . The manufacturing method of a composite poly-silicon substrate of solar cells according to claim 1 , wherein for the step of providing the first substrate layer, the thickness of the first substrate layer ranges from 160 um to 180 um.

3 . The manufacturing method of a composite poly-silicon substrate of solar cells according to claim 2 , wherein for the step of forming the second substrate layer, the thickness of the second substrate layer ranges from 5 um to 20 um.

4 . The manufacturing method of a composite poly-silicon substrate of solar cells according to claim 1 , wherein for the step of forming the second substrate layer, the second substrate layer is formed on the first substrate layer by means of physical vapor deposition (PVD), chemical vapor deposition (CVD), liquid-phase epitaxy (LPE) or sputter deposition.

5 . The manufacturing method of a composite poly-silicon substrate of solar cells according to claim 1 , wherein for the step of forming a second substrate layer, chemical vapor deposition is used to provide a gas mixture of dichlorosilane, diborane, and hydrogen as a mainstream, and wherein the main stream passes over the first substrate layer to begin the chemical vapor deposition process for 20 to 30 minutes under a temperature that ranges from 1000□ to 1100□ to form the p-type silicon second substrate layer.

6 . The manufacturing method of a composite poly-silicon substrate of solar cells according to claim 5 , wherein for the aforementioned CVD method, the flow rate of dichlorosilane ranges from 200 to 300 sccm, the flow rate of diborane ranges from 5 to 10 sccm, and the flow rate of hydrogen ranges from 80 to 100 sccm.

7 . The manufacturing method of a composite poly-silicon substrate of solar cells according to claim 1 , wherein for the step of forming the second substrate layer, the second substrate layer is formed by the sputter deposition method.

8 . The manufacturing method of a composite poly-silicon substrate of solar cells according to claim 7 , wherein the sputter deposition method utilizes a pulsed DC magnetron sputtering device under the conditions with the working pressure ranging from 5×10 −7 Torr to 9×10 −7 Torr, the sputtering power ranging from 100 W to 300 W, the support platform temperature ranging from 200□ to 250□, the deposition pressure at 5 mTorr, and the flowrate of argon (sputtering gas) ranging from 8 to 10 sccm, to form the second substrate layer.

9 . The manufacturing method of a composite poly-silicon substrate of solar cells according to claim 1 , wherein after the step of forming the second substrate layer on the first substrate layer, further comprising a poly-crystallization step.

10 . The manufacturing method of a composite poly-silicon substrate of solar cells according to claim 9 , wherein the poly-crystallization step utilizes the laser crystallization method to transform the amorphous second substrate layer into a poly-crystalline structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2011
From: CHU, CHAO-CHIEH
To: INNOVATION & INFINITY GLOBAL CORP.
Reel/Frame 027461/0623 →