IP Library Patent Application 13341668
Patent Application
App. No. 13/341,668

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE WITH A BACK ELECTRODE

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Quick Facts
Patent No.
US None
App. No.
13/341,668
Abstract

A semiconductor device capable of stabilizing operations thereof is provided. This semiconductor device comprises a substrate provided with a region having concentrated dislocations at least on part of the back surface thereof, a semiconductor element layer formed on the front surface of the substrate, an insulator film formed on the region of the back surface of the substrate having concentrated dislocations and a back electrode formed to be in contact with a region of the back surface of the substrate other than the region having concentrated dislocations.

Claims (13)

1 - 29 . (canceled)

30 . A method of fabricating a semiconductor device with a back electrode, the method comprising the steps of:

forming a semiconductor element layer on a first surface of a substrate, said substrate having a second surface comprising plurality of dislocation regions;

forming a pair of scribing lines on said first surface of said substrate, said scribe lines formed such that a first said dislocation region is between said scribing lines; and

separating said semiconductor element layer and said substrate along said scribing lines, thereby removing a portion of said substrate including said first dislocation region.

31 . A method of fabricating a semiconductor device according to claim 30 , wherein

said portion has a substantially identical width of said second surface and said first surface of said semiconductor element layer.

32 . A method of fabricating a semiconductor device according to claim 30 , wherein

said substrate includes a nitride-based semiconductor substrate.

33 . A method of fabricating a semiconductor device according to claim 30 , wherein

said step of separating said substrate and said semiconductor element layer includes a step of cleaving said substrate and said semiconductor element layer.

34 . A method of fabricating a semiconductor device according to claim 30 , wherein

said scribing lines are formed on a side of a front surface of said semiconductor element layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2016
From: FUTURE LIGHT LIMITED LIABILITY COMPANY
To: SANYO ELECTRIC CO., LTD.
Reel/Frame 040523/0797 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2012
From: SANYO ELECTRIC CO., LTD.
To: FUTURE LIGHT, LLC
Reel/Frame 029296/0409 →