IP Library Patent Application 13342241
Patent Application
App. No. 13/342,241

Self-Aligning Pick and Place Collet for Tape and Reel Machine

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Quick Facts
Patent No.
US None
App. No.
13/342,241
Abstract

Various embodiments of methods and devices are provided for a self-aligning pick and place collet having proximal and distal ends configured for use with a tape and reel machine. A suction area is located at a distal end of the collet. A pick and place collet contact area is located adjacent to and outwardly from the suction area, and comprises tapered sidewalls that depend downwardly and outwardly away from the outer periphery of the suction area. The tapered sidewalls and the outer periphery of the suction area are configured and dimensioned to cause an electronic device to substantially self-align and center itself with respect to the collet when engaged thereby.

Claims (36)

1 . A self-aligning pick and place collet having proximal and distal ends configured for use with a tape and reel machine, comprising:

a vacuum aperture disposed between the proximal and distal ends of the collet and configured to pull a vacuum through a distal portion thereof;

a suction area located at the distal end of the collet, the suction area being contiguous with and adjoining the distal portion of the vacuum aperture and defining a first outer periphery, the suction area being substantially perpendicular to an imaginary axis of the vacuum aperture, and

a pick and place collet contact area located adjacent to and outwardly from the suction area, the pick and place collet contact area comprising tapered sidewalls that depend downwardly and outwardly away from the first outer periphery of the suction area;

wherein the distal end of the collet and the suction area are configured to permit the suction area to be placed over a top surface of an electronic device, and the tapered sidewalls and the first outer periphery of the suction area are configured and dimensioned to cause the electronic device to substantially self-align and center itself with respect to the collet after the distal end of the collet has been placed over the electronic device and portions of the tapered sidewalls have engaged a second outer periphery of the top surface of the electronic device, the collet being configured to permit the electronic device to be picked up after the vacuum has been applied through the vacuum aperture thereto.

2 . The self-aligning pick and place collet of claim 1 , wherein the suction area is substantially flat.

3 . The self-aligning pick and place collet of claim 1 , wherein the tapered sidewalls are at least partially flexible or malleable.

4 . The self-aligning pick and place collet of claim 1 , wherein the tapered sidewalls are further configured to prevent the electronic device from rotating with respect to the distal end of the collet after portions of the tapered sidewalls have engaged the second outer periphery of the electronic device.

5 . The self-aligning pick and place collet of claim 1 , wherein the tapered sidewalls are further configured to prevent the electronic device from rotating with respect to the distal end of the collet after portions of the tapered sidewalls have engaged the second outer periphery of the electronic device and the vacuum has been applied thereto.

6 . The self-aligning pick and place collet of claim 1 , wherein the tapered sidewalls and the outer periphery of the suction area are configured and dimensioned to permit the electronic device to substantially self-align and center itself with respect to the collet after the distal end of the collet has been placed over the electronic device and portions of the tapered sidewalls have engaged the second outer periphery of the top surface of the electronic device when the electronic device is a Surface Mount Technology (SMT) part.

7 . The self-aligning pick and place collet of claim 1 , wherein the tapered sidewalls and the outer periphery of the suction area are configured and dimensioned to permit the electronic device to substantially self-align and center itself with respect to the collet after the distal end of the collet has been placed over the electronic device and portions of the tapered sidewalls have engaged the second outer periphery of the top surface of the electronic device when the electronic device is a Surface Mount Device (SMD) part.

8 . The self-aligning pick and place collet of claim 1 , wherein the first outer periphery of the suction area is substantially rectangular in shape.

9 . The self-aligning pick and place collet of claim 1 , wherein the first outer periphery of the suction area is at least partially curved in shape.

10 . The self-aligning pick and place collet of claim 1 , wherein the portions of the tapered sidewalls that engage the second outer periphery of the electronic device define a substantially rectangular shape.

11 . A tape and reel machine for picking and placing electronic devices, comprising:

a self-aligning pick and place collet having proximal and distal ends configured for use with the tape and reel machine;

a vacuum aperture disposed between the proximal and distal ends of the collet and configured to pull a vacuum through a distal portion thereof;

a suction area located at the distal end of the collet, the suction area being contiguous with and adjoining the distal portion of the vacuum aperture and defining a first outer periphery, the suction area being substantially perpendicular to an imaginary axis of the vacuum aperture, and

a pick and place collet contact area located adjacent to and outwardly from the suction area, the pick and place collet contact area comprising tapered sidewalls that depend downwardly and outwardly away from the first outer periphery of the suction area;

wherein the distal end of the collet and the suction area are configured to permit the suction area to be placed over a top surface of one of the electronic devices, and the tapered sidewalls and the first outer periphery of the suction area are configured and dimensioned to cause the electronic device to substantially self-align and center itself with respect to the collet after the distal end of the collet has been placed over the electronic device and portions of the tapered sidewalls have engaged a second outer periphery of the top surface of the electronic device, the collet being configured to permit the electronic device to be picked up after the vacuum has been applied through the vacuum aperture thereto.

12 . The tape and reel machine of claim 11 , wherein the suction area is substantially flat.

13 . The tape and reel machine of claim 11 , wherein the tapered sidewalls are at least partially flexible or malleable.

14 . The tape and reel machine of claim 11 , wherein the tapered sidewalls are further configured to prevent the electronic device from rotating with respect to the distal end of the collet after portions of the tapered sidewalls have engaged the second outer periphery of the electronic device.

15 . The tape and reel machine of claim 11 , wherein the tapered sidewalls are further configured to prevent the electronic device from rotating with respect to the distal end of the collet after portions of the tapered sidewalls have engaged the second outer periphery of the electronic device and the vacuum has been applied thereto.

16 . The tape and reel machine of claim 11 , wherein the tapered sidewalls and the outer periphery of the suction area are configured and dimensioned to permit the electronic device to substantially self-align and center itself with respect to the collet after the distal end of the collet has been placed over the electronic device and portions of the tapered sidewalls have engaged the second outer periphery of the top surface of the electronic device when the electronic device is a Surface Mount Technology (SMT) part.

17 . The tape and reel machine of claim 11 , wherein the tapered sidewalls and the outer periphery of the suction area are configured and dimensioned to permit the electronic device to substantially self-align and center itself with respect to the collet after the distal end of the collet has been placed over the electronic device and portions of the tapered sidewalls have engaged the second outer periphery of the top surface of the electronic device when the electronic device is a Surface Mount Device (SMD) part.

18 . The tape and reel machine of claim 11 , wherein the first outer periphery of the suction area is substantially rectangular in shape.

19 . The tape and reel machine of claim 11 , wherein the first outer periphery of the suction area is at least partially curved in shape.

20 . The tape and reel machine of claim 11 , wherein the portions of the tapered sidewalls that engage the second outer periphery of the electronic device define a substantially rectangular shape.

21 . A method of picking and placing electronic devices with a tape and reel machine, comprising:

placing a self-aligning pick and place collet having proximal and distal ends over a selected one of the electronic devices disposed on a reel;

causing the collet to move downwardly and engage portions of the selected electronic device such that tapered sidewalls of a pick and place collet contact area located adjacent to and outwardly from a suction area disposed at a distal end of the collet, where the tapered sidewalls depend downwardly and outwardly away from a first outer periphery of the suction area, cause the selected electronic device to substantially self-align and center itself with respect to the collet, and picking the selected electronic device up with the collet after a vacuum has been applied through a vacuum aperture located in the collet.

22 . The method of claim 21 , further comprising moving the selected electronic device over a tape.

23 . The method of claim 22 , further comprising placing the selected electronic device in a pocket disposed over the tape.

24 . The method of claim 23 , further comprising releasing the vacuum in the collet and moving the collet away from the selected electronic device.

25 . The method of claims 21 through 24 , further comprising repeating the steps recited therein with respect to another selected electronic device.

Assignments (6)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0496 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2012
From: TAN, HONG SIA; WONG, CHEE MANG; LEONG, YIK LOONG
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 027467/0491 →