Semiconductor package and method of fabricating the same
View Patent ↗A semiconductor package and a method of manufacturing the same, and more particularly, to a package of a power module semiconductor and a method of manufacturing the same. The semiconductor package includes a substrate including a plurality of conductive patterns spaced apart from one another; a plurality of semiconductor chips disposed on the conductive patterns; a connecting member for electrically connecting the conductive patterns to each other, for electrically connecting the semiconductor chips to each other, or for electrically connecting the conductive pattern and the semiconductor chip; and a sealing member for covering the substrate, the semiconductor chips, and the connecting member, wherein a lower surface of the substrate and an upper surface of the connecting member are exposed to the outside by the sealing member.
1. A semiconductor package comprising:
a support member having a first surface on which first and second conductive patterns are spaced apart from each other;
at least one first semiconductor chip disposed on the first conductive pattern;
a first connecting member for electrically connecting the second conductive pattern and the at least one first semiconductor chip; and
a sealing member for sealing the first semiconductor chip and the first connecting member,
wherein the first connecting member comprises an exposure surface exposed from an upper surface of the sealing member, a horizontal portion on which the exposure surface of the first connecting member is formed, and a first portion and a second portion that are formed on both sides of the horizontal portion and are each extended downward from the horizontal portion, wherein the first portion is connected to the first semiconductor chip and the second portion is connected to a different semiconductor chip or the second conductive pattern.
2. The semiconductor package of claim 1 , wherein the exposure surface of the first connecting member is coplanar with the upper surface of the sealing member.
3. The semiconductor package of claim 1 , wherein the first connecting member comprises at least one of a bonding clip and a bonding ribbon.
4. The semiconductor package of claim 1 , wherein the exposure surface of the first connecting member is treated by a plating process.
5. The semiconductor package of claim 1 , wherein the support member further comprises a third conductive pattern formed on a second surface opposite to the first surface,
wherein the third conductive pattern is exposed from a lower surface of the sealing member.
6. The semiconductor package of claim 1 , wherein the support member is one of a direct bonding copper (DBC) substrate, an insulated metal substrate (IMS), a metalizing ceramic substrate, and a lead frame.
7. The semiconductor package of claim 1 , further comprising: a heat sink disposed on a second surface opposite to the first surface of the support member.
8. The semiconductor package of claim 1 , further comprising: a bonding member formed on the exposure surface of the first connecting member.
9. The semiconductor package of claim 1 , further comprising: a metal slug disposed at least one of the first and second conductive patterns and comprising an exposure surface exposed from the upper surface of the sealing member.
10. The semiconductor package of claim 1 , wherein the first semiconductor chip is part of a plurality of semiconductor chips, further comprising:
a second connecting member for electrically connecting the plurality of semiconductor chips to one another and comprising an exposure surface exposed from the upper surface of the sealing member.
11. The semiconductor package of claim 1 , wherein a fourth conductive pattern spaced apart from the first and second conductive patterns is further formed on the first surface of the support member, further comprising:
a third connecting member for electrically connecting the fourth and first conductive patterns and comprising an exposure surface exposed from the upper surface of the sealing member.
12. The semiconductor package of claim 1 , wherein a fifth conductive pattern spaced apart from the first and second conductive patterns is further formed on the first surface of the support member, further comprising:
at least one second semiconductor chip disposed on the fifth conductive pattern; and
a fourth connecting member for electrically connecting the second and first semiconductor chips or the second semiconductor chip and the second conductive pattern.
13. A semiconductor package comprising:
a support member having a first surface on which first and second conductive patterns are spaced apart from each other;
at least one semiconductor chip disposed on the first conductive pattern;
a first connecting member for electrically connecting the first and second conductive patterns to each other; and
a sealing member for sealing the semiconductor chip and the first connecting member,
wherein the first connecting member comprises an exposure surface exposed from an upper surface of the sealing member, a horizontal portion on which the exposure surface of the first connecting member is formed and a first portion and a second portion that are formed on both sides of the horizontal portion and are each extended downward from the horizontal portion, wherein the first portion is connected to the at least one semiconductor chip and the second portion is connected to a different semiconductor chip or the second conductive pattern.
14. The semiconductor package of claim 13 , wherein the exposure surface of the first connecting member is coplanar with the upper surface of the sealing member.
15. The semiconductor package of claim 13 , wherein the first connecting member comprises at least one of a bonding clip and a bonding ribbon.
16. A semiconductor package comprising:
a support member having a first surface on which first and second conductive patterns are spaced apart from each other;
a plurality of semiconductor chips disposed on the first conductive pattern;
a first connecting member for electrically connecting the plurality of semiconductor chips to one another; and
a sealing member for sealing the plurality of semiconductor chips and the first connecting member,
wherein the first connecting member comprises an exposure surface exposed from an upper surface of the sealing member, a horizontal portion on which the exposure surface of the first connecting member is formed, and a first portion and a second portion that are formed on both sides of the horizontal portion and are each extended downward from the horizontal portion, wherein the first portion is connected to a first semiconductor chip in the plurality of semiconductor chips and the second portion is connected to a second semiconductor chip in the plurality of semiconductor chips or to the second conductive pattern.
17. The semiconductor package of claim 16 , wherein the exposure surface of the first connecting member is coplanar with the upper surface of the sealing member.
18. The semiconductor package of claim 16 , wherein the first connecting member comprises at least one of a bonding clip and a bonding ribbon.