IP Library › Patent Application 13342553
Patent Application
App. No. 13/342,553

TRANSPARENT SUBSTRATE WITH THIN FILM AND METHOD FOR MANUFACTURING TRANSPARENT SUBSTRATE WITH CIRCUIT PATTERN WHEREIN SUCH TRANSPARENT SUBSTRATE WITH THIN FILM IS USED

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Quick Facts
Patent No.
US None
App. No.
13/342,553
Abstract

An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×10 19 /cm 3 or higher, with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.

Claims (7)

1 . A method for manufacturing a transparent substrate bearing a circuit pattern, the method comprising:

providing a thin-film-attached transparent substrate including a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×10 19 /cm 3 or higher; and

irradiating the thin-film-attached transparent substrate with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.

2 . The method for manufacturing a transparent substrate bearing a circuit pattern according to claim 1 , wherein said providing the thin-film-attached transparent substrate comprises forming the transparent conductive film on the transparent substrate, followed by an annealing treatment.

3 . A method for manufacturing a plasma display panel which comprises manufacturing the display panel by the method for manufacturing a transparent substrate bearing a circuit pattern according to claim 1 .

4 . The method for manufacturing a transparent substrate bearing a circuit pattern according to claim 1 , wherein said providing comprises providing the thin-film-attached transparent substrate, wherein the transparent conductive film is a thin film comprising tin oxide as a main component.

5 . The method for manufacturing a transparent substrate bearing a circuit pattern according to claim 1 , wherein said providing comprises providing the thin-film-attached transparent substrate, wherein the transparent conductive film has a thickness of 50-500 nm.