Display substrate, display apparatus having the same and method of manufacturing the same

1. A display substrate comprising:

a base substrate;

a high reflective layer on the base substrate, and comprising a high refractive layer and a low refractive layer which alternate with each other, the high refractive layer having a first refractive index, and the low refractive layer having a second refractive index smaller than the first refractive index;

a low reflective layer comprising a light absorbing layer which absorbs a light, a first insulating layer on a first side of the light absorbing layer and having the second refractive index, and a second insulating layer overlapping an entire second side opposing the first side of the light absorbing layer and having the second refractive index; and

a metal light reflective layer between the high reflective layer and the low reflective layer, wherein the metal light reflective layer reflects the light.

2. The display substrate of claim 1 , wherein the high reflective layer sequentially comprises:

a first high refractive layer on the base substrate and having the first refractive index;

a first low refractive layer on the first high refractive layer and having the second refractive index;

a second high refractive layer on the first low refractive layer and having the first refractive index;

a second low refractive layer on the second high refractive layer and having the second refractive index;

a third high refractive layer on the second low refractive layer and having the first refractive index; and

a third low refractive layer on the third high refractive layer and having the second refractive index.

3. The display substrate of claim 2 , wherein each of the first, second and third high refractive layers comprises silicon nitride (SiN x ).

4. The display substrate of claim 3 , wherein a thickness of the first high refractive layer is larger than a thickness of each of the second and third high refractive layers.

5. The display substrate of claim 1 , wherein each of the first and second insulating layers comprises silicon oxide (SiO x ).

6. The display substrate of claim 1 , wherein the light absorbing layer comprises titanium (Ti).

7. The display substrate of claim 1 , wherein the first refractive index is about 2.3, and the second refractive index is about 1.46.

8. The display substrate of claim 1 , further comprising:

an opening slot which extends through the high reflective layer, the metal light reflective layer and the low reflective layer and exposes the base substrate, in a pixel area of the display substrate, and

a contact hole which extends through the low reflective layer and exposes the metal light reflective layer, outside of the pixel area.

9. The display substrate of claim 1 , further comprising:

a bump on the low reflective layer.

10. A display apparatus, comprising:

a first substrate comprising:

a first base substrate,

a high reflective layer on the base substrate, and comprising a high refractive layer and a low refractive layer which alternate with each other, the high reflective layer having a first refractive index and the low refractive layer having a second refractive index smaller than the first refractive index, and

a low reflective layer comprising a light absorbing layer which absorbs a light, a first insulating layer on a first side of the light absorbing layer and having the second refractive index, and a second insulating layer overlapping an entire second side opposing the first side of the light absorbing layer and having the second refractive index,

a metal light reflective layer between the high reflective layer and the low reflective layer, wherein the metal light reflective layer reflects the light, and

an opening slot which exposes the first base substrate;

a second substrate comprising a shutter which opens and closes the opening slot of the first substrate;

an insulating material between the first and second substrates; and

a backlight unit under the first substrate, wherein the backlight unit generates and emits the light.

11. The display apparatus of claim 10 , wherein the second substrate comprises:

a second base substrate;

a driving element which applies an electronic signal to move the shutter which opens or closes the opening slot;

a third insulating layer which covers the second base substrate and the driving element;

and

a shutter assembly on the third insulating layer, and comprising the shutter and an electrode portion, wherein the electrode portion is on opposing end portions of the shutter and moves the shutter to open or close the opening slot.

12. The display apparatus of claim 11 , wherein the opening slot extends through the high reflective layer, the metal light reflective layer and the low reflective layer, in a pixel area of the first substrate.

13. A method of manufacturing a display substrate, the method comprising:

forming a high reflective layer comprising a high refractive layer and a low refractive layer which alternate with each other on a base substrate, the high refractive layer having a first refractive index, and the low refractive layer having a second refractive index smaller than the first refractive index;

forming a metal light reflective layer which reflects a light, on the high reflective layer; and

forming a low reflective layer comprising:

forming a first insulating layer having the second refractive index, directly on the metal light reflective layer;

forming a light absorbing layer, on the first insulating layer; and

forming a second insulating layer having the second refractive index, on the light absorbing layer.

14. The method of claim 13 , wherein forming the high reflective layer comprises:

forming a first high refractive layer having the first refractive index, directly on the base substrate;

forming a first low refractive layer having the second refractive index, on the first high refractive layer;

forming a second high refractive layer having the first refractive index, on the first low refractive layer;

forming a second low refractive layer having the second refractive index, on the second high refractive layer;

forming a third high refractive layer having the first refractive index, on the second low refractive layer; and

forming a third low refractive layer having the second refractive index, on the third high refractive layer.

15. The method of claim 14 , wherein

forming the first, second and third high refractive layers comprises forming a silicon nitride (SiN x ) layer using a plasma enhanced chemical vapor deposition method, and

forming the first, second and third low refractive layers comprises forming a silicon oxide (SiO x ) layer using the plasma enhanced chemical vapor deposition method.

16. The method of claim 13 , wherein

forming the light absorbing layer comprises forming a titanium (Ti) layer using a plasma sputter deposition method, and

forming the first and second insulating layers comprises forming a silicon oxide (SiO x ) layer using a plasma enhanced chemical vapor deposition method.

17. The method of claim 13 , further comprising:

removing a first portion of the metal light reflective layer and the low reflective layer in a pixel area to form a first slot.

18. The method of claim 17 , wherein forming the first slot comprises:

forming a first photoresist film on the low reflective layer;

patterning an area of the first photoresist film corresponding to the first slot, to form a first pattern;

etching the low reflective layer and the metal light reflective layer using the first pattern; and

removing the first photoresist film.

19. The method of claim 17 , further comprising:

at the same time,

removing a portion of the high reflective layer, to form a second slot through which the base substrate is exposed in the first slot; and

removing a second portion the low reflective layer, to form a contact hole through which the metal light reflective layer is exposed.

20. The method of claim 19 , wherein the forming the second slot and the contact hole at the same time comprises:

forming a second photoresist film on the first slot and the low reflective layer;

patterning areas of the second photoresist film corresponding to the second slot and the contact hole, to form a second pattern;

etching the high reflective layer on which the first slot is formed, and the low reflective layer, using the second pattern; and

removing the second photoresist film.

21. The method of claim 19 , further comprising:

forming a bump on the low reflective layer.