IP Library Granted Patent US 8,728,715
Granted Patent B2
US 8,728,715 · App. 13/350,155 · Granted May 20, 2014

Non-photosensitive siloxane coating for processing hydrophobic photoimageable nozzle plate

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Quick Facts
Patent No.
US 8,728,715
App. No.
13/350,155
Granted
May 20, 2014
Kind
B2
Abstract

A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.

Claims (33)

1. A method of forming a patterned photoresist layer having a hydrophobic surface, the method comprising:

forming a photoresist layer on a substrate;

image patterning the photoresist layer;

performing first stage post-exposure bake to the imaged photoresist layer, wherein the imaged photoresist layer is partially baked;

surface treating the partially post-exposure baked photoresist layer;

performing second stage post-exposure bake to the surface treated partially post-exposure baked photoresist layer; and

developing the second stage post-exposure baked photoresist layer in a single step.

2. The method of claim 1 , wherein the photoresist layer comprises a polymeric material with photoacid generator.

3. The method of claim 1 , wherein the surface treating includes applying siloxane solution on a top surface of the partially post-exposure baked photoresist layer, the siloxane solution comprising an epoxy functionalized siloxane resin dissolved in a hydrocarbon carrier solvent, the epoxy functionalized siloxane resin having at least two epoxy group per molecule.

4. The method of claim 3 , wherein the epoxy functionalized siloxane resin comprises a terminal glycidyl ether group.

5. The method of claim 3 , wherein the epoxy functionalized siloxane resin comprises a pendant glycidyl ether group.

6. The method of claim 3 , wherein the epoxy functionalized siloxane resin comprises a pendant cyclohexene oxide group.

7. The method of claim 3 , wherein the epoxy functionalized siloxane resin comprises a terminal cyclohexene oxide group.

8. The method of claim 3 , wherein the hydrocarbon carrier solvent comprises aliphatic hydrocarbon.

9. The method of claim 3 , wherein the hydrocarbon carrier solvent comprises aromatic hydrocarbon.

10. The method of claim 3 , wherein the hydrocarbon carrier solvent comprises a mixture of aliphatic hydrocarbon and aromatic hydrocarbon.

11. The method of claim 3 , wherein the siloxane solution does not contain photosensitive additive.

12. A method of forming a hydrophobic nozzle plate for a micro-fluid ejection head, comprising:

laminating a photoresist dry film on a flow feature layer of a micro-fluid ejection head structure;

image patterning the laminated photoresist dry film; performing first stage post-exposure bake to the imaged photoresist dry film, wherein the imaged photoresist dry film is partially baked;

surface treating the partially post-exposure baked photoresist dry film;

performing second stage post-exposure bake to the surface treated partially post-exposure baked photoresist dry film; and

developing the second stage post-exposure baked photoresist dry film to form nozzles therein in a single step.

13. The method of claim 12 , wherein the photoresist dry film comprises a polymeric material with photoacid generator.

14. The method of claim 12 , wherein the surface treating includes applying siloxane solution on a top surface of the partially post-exposure baked photoresist layer, the siloxane solution comprising an epoxy functionalized siloxane resin dissolved in a hydrocarbon carrier solvent, the epoxy functionalized siloxane resin having at least two epoxy groups per molecule.

15. The method of claim 14 , wherein the epoxy functionalized siloxane resin comprises a terminal glycidyl ether group.

16. The method of claim 14 , wherein the epoxy functionalized siloxane resin comprises a pendant glycidyl ether group.

17. The method of claim 14 , wherein the epoxy functionalized siloxane resin comprises a pendant cyclohexene oxide group.

18. The method of claim 14 , wherein the epoxy functionalized siloxane resin comprises a terminal cyclohexene oxide group.

19. The method of claim 14 , wherein the hydrocarbon carrier solvent comprises aliphatic hydrocarbon.

20. The method of claim 14 , wherein the hydrocarbon carrier solvent comprises aromatic hydrocarbon solvent.

21. The method of claim 14 , wherein the hydrocarbon carrier solvent comprises a mixture of aliphatic hydrocarbon solvent and aromatic hydrocarbon.

22. The method of claim 14 , wherein the siloxane solution does not contain photosensitive additive.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2025
From: FUNAI ELECTRIC CO., LTD.
To: BRADY WORLDWIDE, INC.
Reel/Frame 070724/0277 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2013
From: LEXMARK INTERNATIONAL, INC.; LEXMARK INTERNATIONAL TECHNOLOGY, S.A.
To: FUNAI ELECTRIC CO., LTD
Reel/Frame 030416/0001 →