IP Library Granted Patent US 8,680,555
Granted Patent B2
US 8,680,555 · App. 13/350,260 · Granted Mar 25, 2014

Semiconductor light emitting device

Inventor: Hwan Hee Jeong (Ulsan, KR)
Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 8,680,555
App. No.
13/350,260
Granted
Mar 25, 2014
Kind
B2
Abstract

Disclosed are a semiconductor light emitting device. The semiconductor light emitting device comprises a light emitting structure comprising a plurality of compound semiconductor layers, a passivation layer at the outside of the light emitting structure, a first electrode layer on the light emitting structure, and a second electrode layer under the light emitting structure.

Claims (16)

1. A semiconductor light emitting device comprising:

a light emitting structure including a first conductive type semiconductor layer, and active layer and a second conductive type semiconductor layer;

a first reflective electrode layer formed on the light emitting structure, the first reflective electrode layer comprising a plurality of reflective patterns and a plurality of openings between the reflective patterns and having a multi-layer comprising at least one selected from the group consisting of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, and Hf;

a second reflective electrode layer formed under the light emitting structure; and

an insulating layer formed at an outer sidewall of the light emitting structure so as to surround a circumference portion of the light emitting structure.

2. The semiconductor light emitting device according to claim 1 , wherein each opening is formed to partially expose the light emitting structure.

3. The semiconductor light emitting device according to claim 1 , wherein the reflective patterns are connected to each other.

4. The semiconductor light emitting device according to claim 1 , wherein the second reflective electrode layer comprising at least one selected from the group consisting of Al, Ag, Pd, Rh, and Pt.

5. The semiconductor light emitting device according to claim 1 , wherein the insulating layer comprises:

a first insulating layer formed at un upper periphery of the second conductive type semiconductor layer; and

a second insulating layer formed at a lower periphery of the first conductive type semiconductor layer and formed at a sidewall of the light emitting structure.

6. The semiconductor light emitting device according to claim 1 , further comprising:

a first conductive supporting member on the first reflective electrode layer; and

a second conductive supporting member under the second reflective electrode layer.

7. The semiconductor light emitting device according to claim 1 , wherein the insulating layer comprises a transparent insulating material.

8. The semiconductor light emitting device according to claim 1 , wherein the second reflective electrode layer has an opening which is formed to expose a part of the semiconductor layer of the light emitting structure.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2025
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: BOE HC SEMITEK LIMITED(HENGQIN)
Reel/Frame 070521/0027 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
Priority Claims (1)
KR 10-2008-0101642 · Oct 16, 2008 · national
Continuity (3)
Continuation 12950449 · Nov 19, 2010
Continuation 12580828 · Oct 16, 2009
Related Publication 20120112232A1 · May 10, 2012