THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE INCORPORATION BY REFERENCE
A three-dimensionally integrated semiconductor device includes a flexible circuit substrate which has a lower portion, an upper portion, and at least one side portion, a support body which supports the upper portion of the flexible circuit substrate, and at least two devices mounted on the flexible circuit substrate and wherein at least one of the devices is mounted on an upper surface of the lower portion of the flexible circuit substrate, at least one of the other devices is mounted on a lower surface of the upper portion of the flexible circuit substrate, and a gap is provided between the device mounted on the upper surface of the lower portion of the flexible circuit substrate and the device mounted on the lower surface of the upper portion of the flexible circuit substrate.
1 . A three-dimensionally integrated semiconductor device comprising:
a flexible circuit substrate which has a lower portion, an upper portion, and at least one side portion,
a support body which supports the upper portion of the flexible circuit substrate, and
at least two devices mounted on the flexible circuit substrate and wherein
at least one of the devices is mounted on an upper surface of the lower portion of the flexible circuit substrate,
at least one of the other devices is mounted on a lower surface of the upper portion of the flexible circuit substrate, and
a gap is provided between the device mounted on the upper surface of the lower portion of the flexible circuit substrate and the device mounted on the lower surface of the upper portion of the flexible circuit substrate.
2 . The three-dimensionally integrated semiconductor device according to claim 1 , wherein
temperature in an operation state of the device mounted on the upper surface of the lower portion of the flexible circuit substrate is different from that of the device mounted on the lower surface of the upper portion of the flexible circuit substrate.
3 . The three-dimensionally integrated semiconductor device according to claim 1 , wherein
the flexible circuit substrate has the lower portion, the upper portion, and the at least two side portions.
4 . The three-dimensionally integrated semiconductor device according to claim 1 , wherein
the support body has a shape of a pillar with a hollow portion and at least two devices are arranged in the hollow portion.
5 . The three-dimensionally integrated semiconductor device according to in claim 1 , wherein
the support body is composed of two or more parts that are separately disposed and at least two devices are arranged in an area surrounded by two or more parts.
6 . The three-dimensionally integrated semiconductor device according to claim 1 , wherein
the three-dimensionally integrated semiconductor device has an opening that is not covered by the flexible circuit substrate and not covered by the support body.
7 . The three-dimensionally integrated semiconductor device according to claim 1 , wherein
two or more devices are mounted on one or both of the lower portion and the upper portion of the flexible circuit substrate.
8 . The three-dimensionally integrated semiconductor device according to claim 1 , wherein
at least one device is mounted on the upper surface of the upper portion of the flexible circuit substrate.
9 . A three-dimensionally integrated semiconductor device, wherein
the three-dimensionally integrated semiconductor devices according to claim 1 are stacked therein.
10 . An electronic device, wherein
the three-dimensionally integrated semiconductor device according to claim 1 is mounted.