IP Library Granted Patent US 8,828,490
Granted Patent B2
US 8,828,490 · App. 13/352,191 · Granted Sep 9, 2014

Vapor deposition method

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Quick Facts
Patent No.
US 8,828,490
App. No.
13/352,191
Granted
Sep 9, 2014
Kind
B2
Abstract

A vapor deposition apparatus, which is capable of performing a thin film deposition process and improving characteristics of a formed thin film, includes: a chamber having an exhaust opening; a stage disposed in the chamber, and comprising a mounting surface on which the substrate may be mounted; an injection unit having at least one injection opening for injecting a gas into the chamber in a direction parallel with a surface of the substrate, on which the thin film is to be formed; a guide member facing the substrate to provide a set or predetermined space between the substrate and the guide member; and a driving unit conveying the stage and the guide member.

Claims (13)

1. A vapor deposition method for forming thin films on a substrate, the method comprising:

mounting the substrate on a mounting surface of a movable stage in a chamber;

injecting a source gas toward a space between the substrate and a movable guide member disposed in parallel with the substrate through an injection unit in a direction parallel with a surface of the substrate, on which thin films are to be formed;

performing exhaustion through an exhaust opening of the chamber;

moving both the stage with the substrate mounted thereon and the guide member;

injecting a reaction gas into the chamber through the injection unit in a direction parallel with the surface of the substrate; and

performing an exhaustion through the exhaust opening of the chamber,

wherein the injection unit injects the reaction gas in a direction parallel in which gravity acts.

2. The method of claim 1 , wherein the exhaustion is performed by a pump.

3. The method of claim 1 , wherein the injection unit has an injection opening, and the source gas and the reaction gas are sequentially injected through the injection opening.

4. The method of claim 1 , wherein the injection unit has a plurality of injection openings, and the source gas and the reaction gas are respectively injected through different ones of injection openings.

5. The method of claim 2 , wherein the mounting of the substrate comprises placing a mask having an opening for forming the thin films of desired pattern on the substrate.

6. The method of claim 1 , wherein the thin film deposition is performed while concurrently moving both the stage with the substrate mounted thereon and the guide member in a direction perpendicular to the surface of the substrate, on which the thin film is formed.

Assignments (1)
MERGER Recorded Aug 20, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028816/0306 →