Chip card, and method for the production thereof
View Patent ↗A chip card in the form of an ID-1 card, a plug-in SIM or a USB token has a layered compound ( 12 ) with two ( 4, 5 ) or three ( 4, 5, 9 ) layers extending over the complete chip card ( 1 ). An exterior foil layer ( 4 ) has on its outward facing front side ( 4 a ) a communication contact layout ( 2 ) and on its back side ( 4 b ) a flip chip ( 7 ), as well as a flip chip contact layout ( 6 ) which is electroconductively connected with the communication contact layout ( 2 ) on the front side.
1. A chip card, comprising a layered material, said layered material comprising:
at least a first layer and a second layer extending over the complete chip card,
said first layer being configured as a foil layer having an outward facing front side and an inward facing back side, wherein the front side comprises a communication contact layout for contact-type communication of the chip card with external communication devices, and wherein the back side is electroconductively connected with a flip chip contact layout;
a flip chip mounted on the back side of the first layer through the flip chip contact layout; and
an intermediate foil arranged between the first layer and the second layer, said intermediate foil comprising a material which is softer than the materials of the first layer and the second layer.
2. The chip card according to claim 1 , wherein at least the communication contact layouts on the front side of the first layer comprise metallization of the first layer.
3. The chip card according to claim 1 , wherein on the back side of the first layer there is provided a coil which is in contact with the flip chip contact layout or with the flip chip.
4. The chip card according to claim 1 , wherein the second layer is also configured as a foil layer.
5. The chip card according to claim 1 , wherein the intermediate foil includes a gap in which the flip chip is disposed.
6. The chip card according to claim 5 , wherein the gap has a depth which corresponds to the thickness of the flip chip.
7. The chip card according to claim 5 , wherein the gap is configured as a through opening in the intermediate foil.
8. The chip card according to claim 1 , wherein the flip chip is embedded in the intermediate foil.
9. The chip card according to claim 1 , wherein the second layer comprises an injection-molded layer.
10. The chip card according to claim 1 , wherein the chip card has the dimensions of a plug-in SIM or an ID-1 chip card.
11. The chip card according to claim 1 , wherein the chip card is configured as a USB token.
12. The chip card according to claim 1 , said second layer being a reinforcement layer comprising a reinforcement foil.
13. The chip card according to claim 1 , wherein the intermediate foil comprises a foam material.