Testing wiring structure and method for forming the same
View Patent ↗The invention provides a method for forming a testing wiring structure of a thin film transistor (TFT) motherboard for applying signals to a plurality of signal lines in a pixel region on the motherboard and a method for forming the same. The formed testing wiring structure comprises a gate layer metallic testing wiring and a drain layer metallic testing wiring that is over and intersects the gate layer metallic testing wiring. A pixel electrode layer testing wiring is further provided over the drain layer metallic testing wiring in an intersecting region where the drain layer metallic testing wiring intersects the gate layer metallic testing wiring. The pixel electrode layer testing wiring is electrically connected to the drain layer metallic testing wiring to be a redundant testing wiring of the drain layer metallic testing wiring.
1. A method for forming a testing wiring structure of a thin film transistor (TFT) array motherboard, comprising:
step 1 of depositing a gate metallic layer on a base substrate and patterning the gate metallic layer so as to form gate lines in a pixel region and a gate layer metallic testing wiring in a testing wiring region, the gate layer metallic testing wiring being connected with a portion of the gate lines;
step 2 of depositing an insulating layer on the base substrate after step 1;
step 3 of forming an active layer in the pixel region on the base substrate after step 2, wherein the active layer is etched away so as not to be left in the testing wiring region;
step 4 of depositing a source/drain metallic layer on the base substrate after step 3 and patterning the source/drain metallic layer so as to form a drain layer metallic testing wiring, the drain layer metallic testing wiring being connected with remaining portion of the gate lines and intersecting the gate layer metallic testing wiring;
step 5 of depositing a passivation layer on the base substrate after step 4 and patterning the passivation layer so as to form via holes in the passivation layer for connection;
step 6 of depositing a pixel electrode layer on the base substrate after step 5 and patterning the pixel electrode layer so as to form a pixel electrode in the pixel region and to form a pixel electrode layer testing wiring intersecting the gate layer metallic testing wiring, both ends of the pixel electrode layer metallic testing wiring being connected through the via holes in the passivation layer to the drain layer metal in the drain layer metallic testing wiring.
2. The method according to claim 1 , wherein the pixel electrode layer testing wiring is spaced apart from the drain layer metallic testing wiring in a longitudinal direction in the intersecting region.
3. The method according to claim 1 , wherein in the step 1, the gate metallic layer is etched away from a region where the drain layer metallic testing wiring is formed later.
4. A method for forming a testing wiring structure of a thin film transistor (TFT) array motherboard, comprising:
step 1 of depositing a gate metallic layer on a base substrate and patterning the gate metallic layer so as to form gate lines in a pixel region and a gate layer metallic testing wiring in a testing wiring region;
step 2 of depositing an insulating layer on the base substrate after step 1;
step 3 of forming an active layer in the pixel region on the base substrate after step 2, wherein the active layer is etched away so as not to be left in the testing wiring region;
step 4 of depositing a source/drain metallic layer on the base substrate after step 3 and patterning the source/drain metallic layer so as to form data lines and a drain layer metallic testing wiring, wherein the drain layer metallic testing wiring is connected with a portion of the data lines and intersecting the gate layer metallic testing wiring, and remaining portion of the data lines are connected to the gate layer metallic testing wiring;
step 5 of depositing a passivation layer on the base substrate after step 4 and patterning the passivation layer so as to form via holes in the passivation layer for connection;
step 6 of depositing a pixel electrode layer on the base substrate after step 5 and patterning the pixel electrode layer so as to form a pixel electrode in the pixel region and to form a pixel electrode layer testing wiring intersecting the gate layer metallic testing wiring, both ends of the pixel electrode layer metallic testing wiring being connected through the via holes in the passivation layer to the drain layer metal in the drain layer metallic testing wiring.
5. The method according to claim 4 , wherein the pixel electrode layer testing wiring is spaced apart from the drain layer metallic testing wiring in a longitudinal direction in the intersecting region.
6. The method according to claim 5 , wherein in the step 1, the gate metallic layer is etched away from a region where the drain layer metallic testing wiring is formed later.