IP Library Granted Patent US 9,222,196
Granted Patent B2
US 9,222,196 · App. 13/354,014 · Granted Dec 29, 2015

Directional solidification furnace for reducing melt contamination and reducing wafer contamination

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Quick Facts
Patent No.
US 9,222,196
App. No.
13/354,014
Granted
Dec 29, 2015
Kind
B2
Abstract

A directional solidification furnace includes a crucible for holding molten silicon and a lid covering the crucible and forming an enclosure over the molten silicon. The crucible also includes an inlet in the lid for introducing inert gas above the molten silicon to inhibit contamination of the molten silicon.

Claims (28)

1. A method of manufacturing a multi-crystalline ingot comprising:

placing solid polysilicon into a crucible;

positioning a lid over the crucible to form an enclosure having a plurality of gaps adjacent the lid and the crucible, the plurality of gaps including a first gap oriented substantially horizontally and a second gap oriented substantially vertically and connected to the first gap, the first and second gaps forming a non-linear flow path and the only exit from the crucible;

applying heat to melt the polysilicon;

introducing inert gas to the enclosure such that the gas purges contaminants from the enclosure and exits the enclosure along the non-linear flow path and only through the gaps; and

solidifying the molten polysilicon to form the ingot.

2. The method of claim 1 wherein the inert gas is introduced through an inlet tube in the lid.

3. The method of claim 2 further comprising purging oxygen from the enclosure prior to introducing inert gas.

4. The method of claim 3 further comprising collecting gas as the gas exits the enclosure.

5. The method of claim 4 further comprising recycling the collected gas.

6. The method of claim 2 wherein solidifying the polysilicon includes removing thermal energy from the crucible.

7. The method of claim 2 further comprising slicing the ingot into wafers.

8. The method of claim 1 wherein the gaps are asymmetric.

9. A method of manufacturing a multi-crystalline ingot comprising:

placing solid polysilicon into a crucible;

placing a lid over the crucible to form an enclosure having labyrinth gaps disposed outside the crucible, beneath a top of the crucible, and between walls of the crucible and plates of the lid;

applying heat to melt the polysilicon;

introducing inert gas to the enclosure such that the gas purges contaminants from the enclosure and exits the enclosure only through the gaps outside of the crucible and between the walls of the crucible and the plates of the lid; and

solidifying the molten polysilicon to form the ingot.

10. The method of claim 9 wherein the inert gas is introduced through an inlet tube in the lid.

11. The method of claim 10 further comprising purging oxygen from the enclosure prior to introducing inert gas.

12. The method of claim 11 further comprising collecting gas as the gas exits the enclosure.

13. The method of claim 12 further comprising recycling the collected gas.

14. The method of claim 9 wherein solidifying the polysilicon includes removing thermal energy from the crucible.

15. The method of claim 9 further comprising slicing the ingot into wafers.

16. The method of claim 9 wherein the gaps are asymmetric to provide a more uniform radial gas flow velocity and a more uniform pressure.

17. The method of claim 1 further comprising positioning brackets between the lid and the crucible, wherein placing the lid over the crucible includes placing the lid over the crucible such that the lid is supported by the brackets.

18. The method of claim 9 further comprising positioning brackets between the lid and the crucible, wherein positioning the lid over the crucible includes positioning lid over the crucible such that the lid is supported by the brackets.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2017
From: SUNEDISON, INC.; SUNEDISON PRODUCTS SINGAPORE PTE. LTD.; MEMC PASADENA, INC.; SOLAICX
To: CORNER STAR LIMITED
Reel/Frame 042351/0659 →
CHANGE OF NAME Recorded Mar 29, 2017
From: MEMC SINGAPORE PTE. LTD. (UEN200614794D)
To: SUNEDISON PRODUCTS SINGAPORE PTE. LTD.
Reel/Frame 042110/0866 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →