IP Library Granted Patent US 8,698,264
Granted Patent B2
US 8,698,264 · App. 13/355,668 · Granted Apr 15, 2014

Photoelectric conversion module

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Quick Facts
Patent No.
US 8,698,264
App. No.
13/355,668
Granted
Apr 15, 2014
Kind
B2
Abstract

A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film.

Claims (30)

1. A photoelectric conversion module comprising:

a substrate having a light transmitting property and having a mounting surface;

a photoelectric conversion element mounted on the mounting surface of said substrate;

a cover member fixed to said substrate via a solder layer constituted by solder and forming, cooperatively with said substrate, an airtight chamber housing said photoelectric conversion element; and

a solder adsorbing film provided near an area fixed to said substrate by the solder layer, in a surface, of said cover member, facing the mounting surface, the solder layer having an adhesive property to said solder adsorbing film.

2. The photoelectric conversion module according to claim 1 , wherein:

said cover member has a depression forming the airtight chamber in the surface facing the mounting surface;

an area near an opening of a wall surface of the depression is inclined relative to the mounting surface; and

said solder adsorbing film is provided at least on the area near the opening of the wall surface of the depression.

3. The photoelectric conversion module according to claim 2 , further comprising:

a conductor pattern formed on the mounting surface and having conductivity; and

an insulating layer provided between said conductor pattern and the solder layer and having an insulating property.

4. The photoelectric conversion module according to claim 3 , wherein said solder adsorbing film covers a whole area of the wall surface of the depression.

5. The photoelectric conversion module according to claim 4 , wherein said solder adsorbing film has conductivity and is grounded.

6. The photoelectric conversion module according to claim 5 , wherein said substrate and said cover member are made of a same material.

7. The photoelectric conversion module according to claim 6 , wherein said substrate and said cover member are each made of one kind selected from a group consisting of silicon, glass, and sapphire.

8. The photoelectric conversion module according to claim 2 , wherein said solder adsorbing film covers a whole area of the wall surface of the depression.

9. The photoelectric conversion module according to claim 8 , wherein said solder adsorbing film has conductivity and is grounded.

10. The photoelectric conversion module according to claim 9 , wherein said substrate and said cover member are made of a same material.

11. The photoelectric conversion module according to claim 10 , wherein said substrate and said cover member are each made of one kind selected from a group consisting of silicon, glass, and sapphire.

12. The photoelectric conversion module according to claim 2 , wherein said substrate and said cover member are made of a same material.

13. The photoelectric conversion module according to claim 12 , wherein said substrate and said cover member are each made of one kind selected from a group consisting of silicon, glass, and sapphire.

14. The photoelectric conversion module according to claim 1 , further comprising:

a conductor pattern formed on the mounting surface and having conductivity; and

an insulating layer provided between said conductor pattern and the solder layer and having an insulating property.

15. The photoelectric conversion module according to claim 14 , wherein said substrate and said cover member are made of a same material.

16. The photoelectric conversion module according to claim 15 , wherein said substrate and said cover member are each made of one kind selected from a group consisting of silicon, glass, and sapphire.

17. The photoelectric conversion module according to claim 1 , wherein said substrate and said cover member are made of a same material.

18. The photoelectric conversion module according to claim 17 , wherein said substrate and said cover member are each made of one kind selected from a group consisting of silicon, glass, and sapphire.

19. The photoelectric conversion module according to claim 1 , wherein said substrate and said cover member are each made of one kind selected from a group consisting of silicon, glass, and sapphire.

Assignments (1)
CHANGE OF NAME Recorded Jan 21, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032006/0194 →