ELECTRODEPOSITION METHODS
Methods of depositing a magnetic material on a substrate, the methods including placing a substrate in an plating solution, the plating solution including an additive selected from malonic acid derivatives; β-diketones and β-diketone derivatives; and C 6 C 3 compounds and C 6 C 3 compound derivatives; and electrochemically depositing a magnetic material on the substrate by pulsing an electrical current connected to the substrate on and off.
1 . A method of depositing a magnetic material on a substrate, the method comprising:
placing a substrate in a plating solution, the plating solution comprising:
an additive selected from the group consisting of:
malonic acid derivatives;
β-diketones and β-diketone derivatives; and
C 6 C 3 compounds and C 6 C 3 compound derivatives; and
electrochemically depositing a magnetic material on the substrate by pulsing an electrical current connected to the substrate on and off.
2 . The method according to claim 1 , wherein the additive is a malonic acid derivative selected from: 2-allyl malonic acid; 2-methyl malonic acid; 2-phenyl malonic acid; 2,2-dimethyl malonic acid; and combinations thereof.
3 . The method according to claim 1 , wherein the additive is a β-diketone or a β-diketone derivative selected from: 1,3-indandione; acetylacetone, 2-phenyl 1,3-indandione; 2-pyridylidene-1,3-indandione; 3-pyridylidene-1,3-indandione; 4-pyridylidene-1,3-indandione; 2-furylidene-1,3-indandione; 3-methyl acetylacetone; and combinations thereof.
4 . The method according to claim 1 , wherein the additive is a C 6 C 3 compound or a C 6 C 3 compound derivative selected from: 7-hydroxy coumarin; 4-hydroxy coumarin; 4,7-dihydroxy coumarin; coniferyl alcohol; and combinations thereof.
5 . The method according to claim 1 , wherein the additive has a concentration of not more than about 0.001 M in the electrolytic solution.
6 . The method according to claim 1 , wherein the electrolytic solution does not contain saccharin.
7 . The method according to claim 1 , wherein the magnetic material deposited is CoFe.
8 . The method according to claim 6 , wherein the CoFe has a magnetic saturation of at least about 2.3 T.
9 . The method according to claim 6 , wherein the CoFe has a corrosion potential of at least about −400 mV vs. SCE obtained by potentiodynamic curves in 0.1M NaCl solution at pH 5.9.
10 . The method according to claim 6 , wherein the CoFe has a film stress that is not greater than about 500 MPa.
11 . The method according to claim 6 , wherein the CoFe has a total concentration of O, S, C, N, H and Cl that is about three times lower than CoFe electrodeposited in the presence of saccharin.
12 . The method according to claim 1 , wherein the electrical current is off for at least about 400 milliseconds between each on pulse.
13 . The method according to claim 1 , wherein the electrical current is on for at least about 200 milliseconds between each off pulse.
14 . A method of depositing a magnetic material on a substrate, the method comprising:
placing a substrate in a plating solution, wherein the plating solution does not contain saccharin;
electrochemically depositing a magnetic material on the substrate by pulsing an electrical current connected to the substrate, wherein the electrical current has an on pulse period and an off pulse period, and wherein the off pulse period is at least about 400 milliseconds.
15 . The method according to claim 14 , wherein the additive is a malonic acid derivative selected from: 2-allyl malonic acid; 2-methyl malonic acid; 2-phenyl malonic acid; 2,2-dimethyl malonic acid; and combinations thereof.
16 . The method according to claim 14 , wherein the additive is a β-diketone or a β-diketone derivative selected from: 1,3-indandione; acetylacetone, 2-phenyl 1,3-indandione; 2-pyridylidene-1,3-indandione; 3-pyridylidene-1,3-indandione; 4-pyridylidene-1,3-indandione; 2-furylidene-1,3-indandione; 3-methyl acetylacetone; and combinations thereof.
17 . The method according to claim 14 , wherein the additive is a C 6 C 3 compound or a C 6 C 3 compound derivative selected from: 7-hydroxy coumarin; 4-hydroxy coumarin; 4,7-dihydroxy coumarin; coniferyl alcohol; and combinations thereof.
18 . The method according to claim 14 , wherein the additive has a concentration of not more than about 0.001 M in the plating solution.
19 . The method according to claim 14 , wherein the magnetic material deposited is CoFe.
20 . A method of depositing a magnetic material on a substrate, the method comprising:
placing a substrate in a plating solution, the plating solution comprising:
not more than about 0.001 M additive, wherein the additive is selected from the group consisting of:
malonic acid derivatives;
β-diketones and β-diketone derivatives; and
C 6 C 3 compounds and C 6 C 3 compound derivatives;
electrolytically depositing a magnetic material on the substrate by pulsing an electrical current connected to the substrate, wherein the electrical current has an on pulse period and an off pulse period, and wherein the off pulse period is at least about 400 milliseconds.