Remote thermal compensation assembly
View Patent ↗A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided.
1. A solid state lighting device comprising:
at least one solid state emitter arranged on a first assembly devoid of thermal compensation circuitry; and
a second assembly devoid of the at least one solid state emitter, the second assembly arranged about the first assembly, the second assembly comprising thermal compensation circuitry in electrical communication with the first assembly wherein the second assembly contacts at least a portion of the first assembly.
2. The solid state lighting device of claim 1 , wherein the second assembly is adjacent to the first assembly.
3. The solid state lighting device of claim 2 , wherein the surface corresponding to the longitudinal axis of the second assembly having the thermal compensation circuitry is coplanar with the surface corresponding to the longitudinal axis of the first assembly having the at least one solid-state emitter.
4. The solid state lighting device of claim 1 , wherein the longitudinal axis of the second assembly is vertically offset from and parallel to the longitudinal axis of the first assembly.
5. The solid state lighting device of claim 1 , wherein the second assembly directly contacts at least a portion of the first assembly.
6. The solid state lighting device of claim 1 , wherein the second assembly surrounds the first assembly.
7. The solid state lighting device of claim 6 , wherein the surface corresponding to the longitudinal axis of the second assembly having the thermal compensation circuitry is coplanar with the surface corresponding to the longitudinal axis of the first assembly having the at least one solid-state emitter.
8. The solid state lighting device of claim 1 , wherein the surface corresponding to the longitudinal axis of the second assembly having the thermal compensation circuitry is vertically offset from and parallel with the surface corresponding to the longitudinal axis of the first assembly having the at least one solid-state emitter.
9. The solid state lighting device of claim 1 , wherein the first assembly is deposited on the second assembly.
10. The solid state lighting device of claim 1 , wherein the first assembly is deposited on a heat sink and the second assembly at least partially surrounds the heat sink.
11. The solid state lighting device of claim 1 , further comprising a third assembly in electrical communication with the first assembly and/or the second assembly, wherein the third assembly comprises at least one of a power supply, a leadframe, a current regulator, a power control, a voltage control, a solenoid, a boost, a capacitor, and a bridge rectifier.
12. The solid state lighting device of claim 1 , wherein the first assembly comprises a metal core printed circuit board and the second assembly comprises a non-metal core printed circuit board.
13. The solid state lighting device of claim 1 , further comprising a heat sink in thermal contact with the first assembly.
14. The solid state lighting device of claim 1 , wherein the second assembly at least partially surrounds the heat sink.
15. A thermal compensating circuit board (TCB) assembly comprising:
a substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter; and
at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply wherein the substrate comprises an opening sized for receiving an LED assembly and/or a heat sink.
16. The assembly of claim 15 , wherein the substrate comprises opposing surfaces, the substrate configured for receiving an LED assembly on one of the opposing surfaces.
17. The assembly of claim 15 , wherein the electrical connector is a flex connector.
18. The assembly device of claim 15 , further comprising a solid state emitter assembly flexibly coupled to the substrate via the electrical connector.
19. The assembly of claim 15 , wherein the substrate comprises at least one aperture configured to receive at least one electrical conductor for operatively connecting to a power supply.
20. An LED lighting device comprising:
a first assembly comprising a plurality of solid state LEDs; and
a second assembly comprising a thermal compensation circuit board (TCB), the second assembly being separate and apart from and adjacent to the first assembly and in electrical communication with the plurality of solid state LEDs; and
optionally, a third assembly in electrical communication with the first assembly and/or the second assembly.
21. The LED lighting device of claim 20 , wherein the first assembly is devoid of a thermal compensation circuit and the second assembly is devoid of the plurality of solid state LEDs.
22. The LED lighting device of claim 20 , wherein the respective surfaces, corresponding to the thermal compensation circuit board and the plurality of solid state LEDs along their respective longitudinal axes of the first assembly and the second assembly, respectively, are in a coplanar arrangement.
23. The LED lighting device of claim 20 , wherein the surface corresponding to the longitudinal axis of the second assembly having the thermal compensation circuit board is vertically offset from and parallel with the surface corresponding to the longitudinal axis of the first assembly having the solid state LEDs.
24. The LED lighting device of claim 20 , wherein the first assembly comprises a metal core printed circuit board (MCPCB) and the second assembly is a non-metal core printed circuit board.
25. The LED lighting device of claim 20 , further comprising a housing supporting the first assembly and the second assembly, the housing configured to contain at least one of ballast, circuit driver, PCB board, a screw base connector, and an electrical plug connector.
26. A device comprising:
at least one solid state emitter arranged on a first assembly;
a second assembly separate from the first assembly, the second assembly comprising thermal compensation circuitry in electrical communication with the first assembly and
a heat sink;
wherein the second assembly is positioned between the first assembly and the heat sink.
27. The device of claim 26 , wherein the first assembly is devoid of a thermal compensation circuit and the second assembly is devoid of the at least one solid state emitter.
28. The device of claim 26 , wherein the second assembly is adjacent to the first assembly.
29. The device of claim 26 , wherein the second assembly at least partially surrounds the first assembly.
30. The device of claim 26 , wherein the first assembly is deposited on the second assembly.
31. The device of claim 26 , wherein the first assembly is deposited on a heat sink and the second assembly at least partially surrounds the heat sink.