Method of forming a coupled coil arrangement
View Patent ↗A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.
1. A method of forming an encapsulated coupled coil arrangement, the method comprising:
coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and
encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material, the jointing alloy having a melting point higher than a highest temperature experienced by the encapsulation material during the encapsulation process, wherein the encapsulation material is a thermoplastic material.
2. The method as claimed in claim 1 , wherein the superconductive jointing alloy has a superconducting transition temperature below about 10 Kelvin.
3. The method as claimed in claim 2 , wherein the superconducting transition temperature is below about 9.2 Kelvin.
4. The method as claimed in claim 3 , wherein the superconducting transition temperature is below about 5 Kelvin.
5. The method as claimed in claim 1 , wherein the electrical circuit device is a second coil.
6. The method as claimed in claim 1 , wherein the electrical circuit device is a cryogenic switch.
7. The method as claimed in claim 1 , wherein the superconductive jointing alloy comprises:
from 40 to 56 wt. % bismuth;
from 44 to 60 wt. % lead;
and a balance of unavoidable impurities.
8. The method as claimed in claim 7 , wherein the superconductive jointing alloy comprises approximately 55.5 wt. % Bi and approximately 44.5 wt. % Pb.
9. The method as claimed in claim 1 , wherein the superconductive jointing alloy comprises:
from 30 to 55 wt. % bismuth;
from 30 to 50 wt. % lead;
from 15 to 30 wt. % tin;
and a balance of unavoidable impurities.
10. The method as claimed in claim 9 , the superconductive jointing alloy comprises approximately 52.5 wt. % Bi, approximately 32 wt. % Pb and approximately 15.5 wt. % Sn.
11. The method as claimed in claim 1 , wherein the superconductive alloy is in the form of a bar, a stick, a powder, a solid or cored wire, a foil, a preform or a paste.
12. The method as claimed in claim 1 , wherein the superconductive alloy has a melting point above about 90° C.
13. A method of forming a superconductive magnet for tomography, the method comprising the method of forming an encapsulated coupled coil arrangement as claimed in claim 1 .