Board-level heat transfer apparatus for communication platforms
View Patent ↗An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit boards being held against a portion of the cooler by a corresponding force, some of the electronic circuit boards having a localized heat source thereon The apparatus also comprises a plurality of heat spreaders, each heat spreader configured to form a heat conducting path over and adjacent to one of the electronic circuit boards from one or more of the localized heat sources thereon to the portion of the cooler. The apparatus also comprises a plurality of compliant thermal interface pads, each of the pads being compressed between end of one of the heat spreaders and the portion of the cooler to form a heat conduction path therebetween.
1. An apparatus, comprising:
a rack;
a cooler;
a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit boards being held against a portion of the cooler by a corresponding force, some of the electronic circuit boards having a localized heat source thereon;
a plurality of heat spreaders, each heat spreader configured to form a heat conducting path over and adjacent to one of the electronic circuit boards from one or more of the localized heat sources thereon to the portion of the cooler; and
a plurality of compliant thermal interface pads, each of the pads being compressed between an end of one of the heat spreaders and the portion of the cooler to form a heat conduction path therebetween.
2. The apparatus of claim 1 , wherein one or more of the compliant thermal interface pads has a thermal conductivity of at least 1 W/m−K.
3. The apparatus of claim 1 , wherein at least one of the compliant thermal interface pads is an elastic thermal interface pad.
4. The apparatus of claim 3 , wherein a thickness of the elastic thermal interface pad is compressible by at least 10 percent when subjected to the force on the corresponding one of the boards and the thickness returns substantially back to its pre-compression value when the force on the corresponding one of the boards is not applied to the elastic thermal interface pad.
5. The apparatus of claim 1 , wherein one or more of the compliant thermal interface pads are configured to be fixed to one or both of the heat spreader or the common cooler.
6. The apparatus of claim 1 , wherein one or more of the compliant thermal interface pads have an electrically insulating outer surface.
7. The apparatus of claim 1 , wherein one or more of the compliant thermal interface pads have a substantially planar surface that is configured to interface with a planer surface of the heat spreader and with a planar surface of the common cooler.
8. The apparatus of claim 1 , wherein each force is created by a spring-loaded or leaver-actuated latch applied to a faceplate of the corresponding one of the electronic circuit boards.
9. The apparatus of claim 1 , wherein the electronic circuit boards fit into single slot of less than about 25 mm in width.
10. The apparatus of claim 1 , wherein some of the circuit boards swappable out of the rack without interrupting electrical power provided to the other ones of the plurality of circuit boards.
11. The apparatus of claim 1 , the heat spreader is mechanically attached to one of the localized heat sources.
12. The apparatus of claim 1 , wherein a portion of the heat spreader facing the portion of the cooler is a planar surface that is parallel to a planar surface of the portion of the cooler.
13. The apparatus of claim 1 , wherein the cooler is configured as an evaporator having a two-phase cooling loop.
14. The apparatus of claim 1 , wherein the portion of the cooler is positioned in a space between the circuit boards and an electronic backplane of the rack.
15. The apparatus of claim 1 , wherein the cooler is configured to circulate a refrigerant that is a gas at an ambient temperature and pressure.
16. The apparatus of claim 1 , further including an air-flow device located in the rack and configured to remove heat from the circuit boards.
17. A method of assembling an apparatus, comprising:
installing a plurality of electronic circuit boards in slots of a rack such that each of the installed electronic circuit boards is held against a portion of a cooler for the rack by a corresponding force, some of the installed electronic circuit boards having localized heat sources thereon and having heat spreaders configured to form heat conducting paths from the localized heat sources to the cooler; and wherein the installing causes a compliant thermal interface pad to be compressed between an end of each of the heat spreaders and the cooler such that the compressed thermal interface pad completes a heat conducting path between the end and the cooler.
18. The method of claim 17 , further including:
attaching an air-flow device in the rack, the air-flow device configured to direct a flow of air over the circuit boards and the heat spreader.
19. The method method of claim 17 , further including: swapping out an electronic circuit, comprising:
detaching an installed electronic circuit board from slots of a rack, thereby breaking a connection between a compliant thermal interface pad, and a heat spreader or a cooler inside the rack.
20. The method of claim 19 , further including:
replacing the detached electronic circuit board with a different electronic circuit board by applying a force to the different circuit board, such that the compliant thermal interface pad is in-between the heat spreader of the different circuit board and the cooler.