IP Library Patent Application 13361092
Patent Application
App. No. 13/361,092

METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE

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Quick Facts
Patent No.
US None
App. No.
13/361,092
Abstract

A photoresist film forming process is performed by the use of a forming apparatus that has a sprayer which generates an air flow toward metal film on a wafer to spray the photoresist material, and a plurality of spacers which is disposed between a work stage and the wafer.

Claims (19)

1 . A method of manufacturing a piezoelectric vibrating reed comprising:

a mask forming process of applying a mask material to a coating film formed on a piezoelectric plate to form a mask on the coating film;

a mask pattern forming process of patterning the mask to form a mask pattern; and

a coating film pattern forming process of removing the coating film of a region other than a forming region of the mask pattern to form the coating film pattern,

wherein the mask forming process is performed by the use of a mask forming apparatus that has a sprayer which generates an air flow toward the coating film to spray the mask material, and ventilation means for distributing the air flow to a side opposite to the sprayer with respect to the piezoelectric plate.

2 . The method according to claim 1 ,

wherein, in the mask forming process, the spraying by the sprayer is performed in the state of setting the piezoelectric plate on a work stage disposed at a side opposite to the sprayer with respect to the piezoelectric plate, and

the ventilation means is a spacer that is disposed between the piezoelectric plate and the work stage.

3 . The method according to claim 1 ,

wherein, in the mask forming process, the spraying by the sprayer is performed in the state of setting the piezoelectric plate on the work stage disposed at a side opposite to the sprayer with respect to the piezoelectric plate, and

the ventilation means is a vent hole that is formed so as not to overlap the piezoelectric plate in a thickness direction in the work stage.

4 . The method according to claim 1 ,

wherein the coating film is a conductive metal film that becomes an electrode formed on the piezoelectric plate, and

the mask material is a photoresist material that becomes a mask when forming the electrode.

5 . A piezoelectric vibrating reed manufactured by the use of the method of manufacturing the piezoelectric vibrating reed according to claim 1 .

6 . A piezoelectric vibrator in which the piezoelectric vibrating reed according to claim 5 is sealed in a package in an air-tight manner.

7 . An oscillator in which the piezoelectric vibrator according to claim 6 is electrically connected to an integrated circuit as an oscillating element.

8 . An electronic apparatus in which the piezoelectric vibrator according to claim 6 is electrically connected to a clock portion.

9 . A radio timepiece in which the piezoelectric vibrator according to claim 6 is electrically connected to a filter portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2013
From: SEIKO INSTRUMENTS INC.
To: SII CRYSTAL TECHNOLOGY INC.
Reel/Frame 031085/0852 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2012
From: IROKAWA, DAIKI
To: SEIKO INSTRUMENTS INC.
Reel/Frame 027619/0004 →