Granted Patent B2

US 8,670,238 · App. 13/362,681 · Granted Mar 11, 2014

Abstract

Claims (52)

1. A guide rail system for mounting one or more optical communications modules on a host circuit board, the guide rail system comprising:

the host circuit board having a top surface and a bottom surface, the circuit board having an opening formed therein where a portion of the circuit board is absent;

a first portion of the guide rail system having a top surface and a bottom surface, the top surface of the first portion being secured to the bottom surface of the circuit board at locations of the bottom surface of the circuit board adjacent the opening formed in the circuit board, the first portion comprising:

a back plate comprising a thermally-conductive material, the back plate having an top surface and a bottom surface; and

a subassembly mounted on the top surface of the back plate, the subassembly comprising a thermally-conductive material, the subassembly comprising a plurality of pairs of parallel guide rails including a first pair of adjacent guide rails, each guide rail having a groove therein that extends along the respective guide rail, wherein each pair of guide rails defines a track that is parallel to the grooves and the guide rails, and wherein the grooves on opposite sides of each track are spaced apart by a predetermined distance; and

a second portion of the guide rail system disposed on a bottom surface of a first optical communications module, the second portion comprising at least a first guide block having side edges that extend along opposite sides of the guide block, the side edges being parallel to one another and being spaced apart by approximately said predetermined distance, and wherein the side edges are slidingly engaged with the grooves of the first pair of adjacent guide rails to enable the first optical communications module to slide within the track defined by the first pair of adjacent guide rails in directions that are parallel to the grooves of the first pair of adjacent guide rails.

2. The guide rail system of claim 1 , further comprising:

a heat dissipation structure secured to the bottom surface of the back plate, wherein at least some heat generated by the first optical communications module passes through the subassembly into the back plate, and wherein at least some of the heat that passes into the back plate is transferred from the back plate to the heat dissipation structure where it is dissipated.

3. The guide rail system of claim 2 , further comprising:

a heat dissipation structure disposed on a top surface of the first optical communications module.

4. The guide rail system of claim 1 , wherein the plurality of pairs of parallel guide rails further includes a second pair of adjacent guide rails, and

wherein the second portion further comprises: at least a second guide block disposed on a bottom surface of a second optical communications module, the second guide block having side edges that extend along the second guide block parallel to one another and that are spaced apart by approximately said predetermined distance, and wherein the side edges of the second guide block are slidingly engaged with the grooves of the second pair of adjacent guide rails to enable the second optical communications module to slide within the track defined by the second pair of adjacent guide rails in directions that are parallel to the grooves of the second pair of adjacent guide rails.

5. The guide rail system of claim 1 , further comprising:

a latching mechanism secured to a bottom surface of the first optical communications module for latching the first optical communications module to the first portion of the guide rail system to prevent movement of the first optical communications module, wherein no part of the latching mechanism extends outwardly from side surfaces of the first optical communications module.

6. The guide rail system of claim 1 , wherein the first optical communications module is an optical transceiver module.

7. The guide rail system of claim 1 , wherein the first optical communications module is an optical transmitter module.

8. The guide rail system of claim 1 , wherein the first optical communications module is an optical receiver module.

9. A guide rail system for mounting optical communications modules on a host circuit board, the guide rail system comprising:

the circuit board having a top surface and a bottom surface, the circuit board having an opening formed therein where a portion of the circuit board is absent;

a first portion of the guide rail system having a top surface and a bottom surface, the top surface of the first portion being secured to the bottom surface of the circuit board at locations of the bottom surface of the circuit board adjacent the opening formed in the circuit board, the first portion comprising:

a back plate comprising a thermally-conductive material, the back plate having an top surface and a bottom surface; and

a subassembly mounted on the top surface of the back plate, the subassembly comprising a thermally-conductive material, the subassembly comprising a plurality of pairs of parallel guide rails including first and second pairs of adjacent guide rails, each guide rail having a groove therein that extends along the respective guide rail, wherein each pair of guide rails defines a track that is parallel to the grooves and the guide rails, and wherein the grooves on opposite sides of each track are spaced apart by a predetermined distance; and

a second portion of the guide rail system comprising at least first and second guide blocks disposed on bottom surfaces of first and second optical communications modules, respectively, the first and second guide blocks each having side edges that extend along opposite sides of the guide block, the side edges being parallel to one another, the side edges of the first guide block being spaced apart by approximately said predetermined distance and the side edges of the second guide block being spaced apart by said predetermined distance, and wherein the side edges of the first guide block are slidingly engaged with the grooves of the first pair of adjacent guide rails to enable the first optical communications module to slide within the track defined by the first pair of adjacent guide rails in directions that are parallel to the grooves of the first pair of adjacent guide rails, and wherein the side edges of the second guide block are slidingly engaged with the grooves of the second pair of adjacent guide rails to enable the second optical communications module to slide within the track defined by the second pair of adjacent guide rails in directions that are parallel to the grooves of the second pair of adjacent guide rails.

10. The guide rail system of claim 9 , further comprising:

a heat dissipation structure secured to the bottom surface of the back plate, wherein at least some heat generated by the first and second optical communications modules passes from the first and second guide blocks into the subassembly, and wherein at least some of the heat that passes into the subassembly subsequently passes from the subassembly into the back plate, and wherein at least some of the heat that passes into the back plate is transferred from the back plate to the heat dissipation structure where it is dissipated.

11. The guide rail system of claim 10 , further comprising: first and second heat dissipation structures disposed on top surfaces of the first and second optical communications modules, respectively.

12. The guide rail system of claim 9 , further comprising: first and second latching mechanisms secured to bottom surfaces of the first and second optical communications modules, respectively, for latching the first and second optical communications module to the first portion of the guide rail system to prevent movement of the first and second optical communications module, wherein no part of the first and second latching mechanisms extends outwardly from side surfaces of the first and second optical communications module, respectively.

13. A guide rail system for mounting optical communications modules on a host circuit board, the guide rail system comprising:

the host circuit board having a top surface and a bottom surface, the circuit board having an opening formed therein where a portion of the circuit board is absent;

a first portion of the guide rail system having a top surface and a bottom surface, the top surface of the first portion being secured to the bottom surface of the circuit board at locations of the bottom surface of the circuit board adjacent the opening formed in the circuit board, the first portion comprising:

a back plate comprising a thermally-conductive material, the back plate having an top surface and a bottom surface; and

a subassembly mounted on the top surface of the back plate, the subassembly comprising a thermally-conductive material, the subassembly comprising a plurality of pairs of parallel guide rails including a first pair of adjacent guide rails, each guide rail having a groove therein that extends along the respective guide rail, wherein each pair of guide rails defines a track that is parallel to the grooves and the guide rails, and wherein the grooves on opposite sides of each track are spaced apart by a predetermined distance;

a second portion of the guide rail system disposed on a bottom surface of a first optical communications module, the second portion comprising at least a first guide block having side edges that extend along opposite sides of the guide block, the side edges being parallel to one another and being spaced apart by approximately said predetermined distance, and wherein the side edges are slidingly engaged with the grooves of the first pair of adjacent guide rails to enable the first optical communications module to slide within the track defined by the first pair of adjacent guide rails in directions that are parallel to the grooves of the first pair of adjacent guide rails; and

a heat dissipation structure secured to the bottom surface of the back plate, wherein at least some heat generated by the first optical communications module passes through the subassembly into the back plate, and wherein at least some of the heat that passes into the back plate is transferred from the back plate to the heat dissipation structure where it is dissipated.

14. The guide rail system of claim 13 , wherein the plurality of pairs of parallel guide rails further includes a second pair of adjacent guide rails, and

wherein the second portion further comprises: at least a second guide block disposed on a bottom surface of a second optical communications module, the second guide block having side edges that extend along the second guide block parallel to one another and that are spaced apart by approximately said predetermined distance, and wherein the side edges of the second guide block are slidingly engaged with the grooves of the second pair of adjacent guide rails to enable the second optical communications module to slide within the track defined by the second pair of adjacent guide rails in directions that are parallel to the grooves of the second pair of adjacent guide rails.

15. The guide rail system of claim 14 , further comprising:

a heat dissipation structure disposed on a top surface of the first optical communications module.

16. The guide rail system of claim 13 , further comprising:

a latching mechanism secured to a bottom surface of the first optical communications module for latching the first optical communications module to the first portion of the guide rail system to prevent movement of the first optical communications module, wherein no part of the latching mechanism extends outwardly from side surfaces of the first optical communications module.

17. A method for using a guide rail system for mounting one or more optical communications modules on a host circuit board, the method comprising:

providing the host circuit board having a top surface and a bottom surface, the circuit board having an opening formed therein where a portion of the circuit board is absent;

providing a guide rail system comprising a first portion and a second portion, the first portion of the guide rail system having a top surface and a bottom surface, the top surface of the first portion being secured to the bottom surface of the circuit board at locations of the bottom surface of the circuit board adjacent the opening formed in the circuit board, the first portion comprising a back plate and a subassembly, the back plate and the subassembly comprising a thermally-conductive material, the back plate having a top surface and a bottom surface, wherein the subassembly is mounted on the top surface of the back plate, the subassembly comprising a plurality of pairs of parallel guide rails including a first pair of adjacent guide rails, each guide rail having a groove therein that extends along the respective guide rail, each pair of guide rails defining a track that is parallel to the grooves and the guide rails, and wherein the grooves on opposite sides of each track are spaced apart by a predetermined distance, and wherein the second portion of the guide rail system comprises at least a first guide block disposed on a bottom surface of a first optical communications module, the first guide block having side edges that extend along opposite sides of the first guide block, the side edges being parallel to one another and being spaced apart by approximately said predetermined distance; and

slidingly engaging the side edges of the first guide block with the grooves of the first pair of adjacent guide rails to enable the first optical communications module to slide within the track defined by the first pair of adjacent guide rails in directions that are parallel to the grooves of the first pair of adjacent guide rails.

18. The method of claim 17 , further comprising:

disposing a heat dissipation structure on the bottom surface of the back plate, wherein at least some heat generated by the first optical communications module passes through the subassembly into the back plate, and wherein at least some of the heat that passes into the back plate is transferred from the back plate to the heat dissipation structure where it is dissipated.

19. The method of claim 18 , further comprising:

disposing a heat dissipation structure on a top surface of the first optical communications module.

20. The method of claim 17 , wherein a latching mechanism is secured to a bottom surface of the first optical communications module for latching the first optical communications module to the first portion of the guide rail system to prevent movement of the first optical communications module, wherein no part of the latching mechanism extends outwardly from side surfaces of the first optical communications module.

21. The method of claim 17 , wherein the plurality of pairs of parallel guide rails further includes a second pair of adjacent guide rails,

wherein the second portion of the guide rail system further comprises a second guide block that is disposed on a bottom surface of a second optical communications module, the second guide block having side edges that extend along the second guide block parallel to one another and that are spaced apart by approximately said predetermined distance, and

wherein the method further comprises: slidingly engaging the side edges of the second guide block with the grooves of the second pair of adjacent guide rails to enable the second optical communications module to slide within the track defined by the second pair of adjacent guide rails in directions that are parallel to the grooves of the second pair of adjacent guide rails.

Assignments (11)