METHODS AND DEVICES FOR ENHANCING CHEMICAL MECHANICAL POLISHING PAD PROCESSES
The present invention discloses a CMP device and methods that are capable of improving CMP processing through incorporation of vibration sources which produce vibrations in a direction substantially parallel to the working surface of the CMP pad. The CMP device includes a CMP pad dresser. Such a method can include steps of vibrating a CMP pad, CMP pad dresser, or wafer in a direction substantially parallel to a working surface of the CMP pad and engaging the CMP pad dresser with a working surface of a CMP pad The results of vibrating the superabrasive particles can provide benefits to both the CMP pad and dresser, according to several aspects disclosed herein.
1 . A CMP pad dresser device, comprising:
a substrate member having a working surface;
a plurality of superabrasive particles coupled to the working surface of the substrate member; and
at least one vibrator coupled to the CMP pad dresser at a location that vibrates the dresser in a direction substantially parallel to a working surface of a CMP pad with which the CMP pad dresser is engaged.
2 . The device of claim 1 , wherein the vibrator is an ultrasonic transducer.
3 . The device of claim 2 , wherein the ultrasonic transducer comprises a piezoelectric material.
4 . The device of claim 2 , wherein the vibrator comprises a solenoid.
5 . The device of claim 1 , wherein the vibrator controls vibration direction.
6 . The device of claim 2 , wherein the vibrator vibrates the CMP pad dresser at an ultrasonic frequency greater than 15 kHz.
7 . The device of claim 1 , wherein the superabrasive particles are selected from a group consisting of diamond, diamond-like carbon, polycrystalline diamond (PCD), cubic boron nitride (cBN), and polycrystalline cubic boron nitride (PCBN).
8 . The device of claim 1 , wherein the superabrasive particles are arranged in a predetermined pattern on the working surface of the substrate member.
9 . The device of claim 8 , wherein the predetermined pattern is substantially uniform.
10 . The device of claim 1 , wherein the superabrasive particles extend to a predetermined height above the substrate member.
11 . The device of claim 10 , wherein the predetermined height provides troughs of corresponding depth in the CMP pad.
12 . The device of claim 1 , wherein the substrate member is a metallic material.
13 . The device of claim 1 , wherein the substrate member is an organic material.
14 . The device of claim 1 , further comprising an amplifier.
15 . The device of claim 1 , further comprising a damping plate.
16 . The device of claim 1 , wherein the at least one vibrator is attached to the CMP pad dresser at a periphery of the substrate member.
17 . The device of claim 1 , wherein the at least one vibrator is coupled to the CMP pad dresser at a location on the substrate member and opposite of the working surface of the substrate member.
18 . A CMP pad device, comprising:
a substrate member having a working surface;
a CMP pad dresser optionally engaged with at least a portion of the working surface; and
at least one vibrator coupled to the CMP pad at a location that vibrates the pad in a direction substantially parallel to a working surface of the working surface.
19 . A method of minimizing a drag coefficient on superabrasive particles of a CMP pad dresser during a CMP pad conditioning process, comprising:
vibrating, in a direction substantially parallel to a working surface of the CMP pad, a member selected from the CMP pad, the CMP pad dresser, a wafer being polished by the CMP pad, or a combination thereof; and
engaging the CMP pad dresser with a working surface of the CMP pad such that oscillation between the CMP pad dresser and the CMP pad occurs in a direction substantially parallel to a working surface of the CMP pad.