IP Library Granted Patent US 8,816,352
Granted Patent B2
US 8,816,352 · App. 13/365,775 · Granted Aug 26, 2014

Display device and electronic device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,816,352
App. No.
13/365,775
Granted
Aug 26, 2014
Kind
B2
Abstract

Disclosed herein is a display device including: a thin film transistor; and a wiring layer; wherein the thin film transistor includes a semiconductor layer, a gate electrode disposed so as to be opposed to the semiconductor layer, the gate electrode being different in thickness from the wiring layer, and a gate insulating film between the semiconductor layer and the gate electrode.

Claims (16)

1. A display device comprising: a thin film transistor; and a wiring layer in contact with a substrate; wherein said thin film transistor includes a semiconductor layer, a gate electrode disposed so as to be opposed to said semiconductor layer, the gate electrode being different in thickness from said wiring layer, and a gate insulating film between said semiconductor layer and said gate electrode, wherein the gate insulating film is not in contact with the wiring layer, wherein the wiring layer is formed as a separate component from a source and a drain, and wherein the source and the drain are connected to the semiconductor layer, wherein said wiring layer has a multilayer structure comprising an upper layer that is furthest from the substrate, and wherein the upper layer has a film thickness that is the same as a gate film thickness of said gate electrode.

2. The display device according to claim 1 , wherein thickness of said gate electrode is smaller than thickness of said wiring layer.

3. The display device according to claim 1 , wherein said wiring layer has a multilayer structure, and film thickness and constituent material of at least one layer are same as film thickness and constituent material of said gate electrode.

4. The display device according to claim 1 , wherein at least a part of constituent material is different between said wiring layer and said gate electrode.

5. The display device according to claim 1 , wherein at least a part of said wiring layer is formed of a material having lower electric resistance than constituent material of said gate electrode.

6. The display device according to claim 1 , wherein said semiconductor layer is formed by an oxide semiconductor film.

7. The display device according to claim 1 , wherein said semiconductor layer is formed by a crystalline oxide semiconductor.

8. The display device according to claim 1 , wherein said gate electrode and said semiconductor layer are formed by a sputtering method.

9. The display device according to claim 1 , wherein said thin film transistor has a structure formed by laminating said gate electrode, said gate insulating film, said semiconductor layer, and a source electrode and a drain electrode electrically connected to said semiconductor layer in this order from a side of a substrate.

10. The display device according to claim 1 , wherein said thin film transistor has a structure formed by laminating a source electrode and a drain electrode electrically connected to said semiconductor layer, said semiconductor layer, said gate insulating film, and said gate electrode in this order from a side of a substrate.

11. A display device comprising: a thin film transistor; and a wiring layer in contact with a substrate; wherein said thin film transistor includes a semiconductor layer, a gate electrode disposed so as to be opposed to said semiconductor layer, at least a part of constituent material being different between the gate electrode and said wiring layer, and a gate insulating film between said semiconductor layer and said gate electrode, wherein the gate insulating film is not in contact with the wiring layer, wherein said wiring layer has a multilayer structure comprising an upper layer that is furthest from the substrate, and wherein the upper layer has a film thickness that is the same as a gate film thickness of said gate electrode.

12. The display device according to claim 11 , wherein said wiring layer has a multilayer structure, and includes at least one layer formed of a same constituent material with a same film thickness as said gate electrode and one layer formed of a material having lower electric resistance than constituent material of said gate electrode, and wherein the wiring layer is formed as a separate component from a source and a drain, and wherein the source and the drain are connected to the semiconductor layer.

13. An electronic device comprising: a display device; wherein said display device includes a thin film transistor, and a wiring layer in contact with a substrate, and said thin film transistor includes a semiconductor layer, a gate electrode disposed so as to be opposed to said semiconductor layer, the gate electrode being different in thickness from said wiring layer, and a gate insulating film between said semiconductor layer and said gate electrode, wherein the gate insulating film is not in contact with the wiring layer, wherein the wiring layer is formed as a separate component from a source and a drain, and wherein the source and the drain are connected to the semiconductor layer, wherein said wiring layer has a multilayer structure comprising an upper layer that is furthest from the substrate, and wherein the upper layer has a film thickness that is the same as a gate film thickness of said gate electrode.

14. An electronic device comprising: a display device; wherein said display device includes a thin film transistor, and a wiring layer in contact with a substrate, and said thin film transistor includes a semiconductor layer, a gate electrode disposed so as to be opposed to said semiconductor layer, at least a part of constituent material being different between the gate electrode and said wiring layer, and a gate insulating film between said semiconductor layer and said gate electrode, wherein the gate insulating film is not in contact with the wiring layer, wherein said wiring layer has a multilayer structure comprising an upper layer that is furthest from the substrate, and wherein the upper layer has a film thickness that is the same as a gate film thickness of said gate electrode.

15. The device of claim 1 , wherein the wiring layer is laminated to the substrate.

16. The device of claim 1 , wherein the wiring layer is formed by sputtering or chemical vapor deposition.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2025
From: JDI DESIGN AND DEVELOPMENT G.K.
To: MAGNOLIA BLUE CORPORATION
Reel/Frame 072039/0656 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2024
From: JOLED, INC.
To: JDI DESIGN AND DEVELOPMENT G.K.
Reel/Frame 066382/0619 →
CORRECTION BY AFFIDAVIT FILED AGAINST REEL/FRAME 063396/0671 Recorded Jun 12, 2023
From: JOLED, INC.
To: JOLED, INC.
Reel/Frame 064067/0723 →
SECURITY INTEREST Recorded Apr 20, 2023
From: JOLED, INC.
To: INCJ, LTD.
Reel/Frame 063396/0671 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2015
From: SONY CORPORATION
To: JOLED INC.
Reel/Frame 036106/0355 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2012
From: TERAI, YASUHIRO; ARAI, TOSHIAKI
To: SONY CORPORATION
Reel/Frame 027650/0790 →