IP Library Granted Patent US 8,785,818
Granted Patent B2
US 8,785,818 · App. 13/366,135 · Granted Jul 22, 2014

Athermalized permanent-alignment optical-element mount

Inventors: Andreas Diening (Santa Clara, CA); Donald E. Harryman (Sunnyvale, CA); Ezra Allee (San Jose, CA)
Assignee: Coherent, Inc.
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Quick Facts
Patent No.
US 8,785,818
App. No.
13/366,135
Granted
Jul 22, 2014
Kind
B2
Abstract

A mounting fixture for mounting an optical element on a base-plate has spaced-apart parallel legs attachable by brackets to the base-plate and a mounting platform attached to the legs. The platform can be heated by a removable heater. The optical element is held in a mounting tab attached to the platform by a solder-pad. Heating the platform softens the solder-pad allowing the tab and the element to be aligned. Removing the heat allows the pad to harden to complete the attachment and retain the alignment of the element on the mount.

Claims (43)

1. Optical apparatus, comprising:

a base-plate;

an optical element;

an element-holding member, fixedly holding the optical element;

a pedestal having a platform-portion for supporting the element-holding member and having spaced-apart legs extending from the platform-portion and attached to the base-plate; and

wherein the element-holding member is attached to the platform-portion of the pedestal by a solder layer, and the platform-portion of the pedestal is temporarily heatable by a removable heat-source to soften the solder layer for aligning the element-holding member on the platform-portion of the pedestal.

2. Optical apparatus, comprising:

a base-plate;

an optical element;

an element-holding member, fixedly holding the optical element;

a pedestal having a platform-portion for supporting the element-holding member and having spaced-apart legs extending from the platform-portion and attached to the base-plate; and

wherein the element-holding member is attached to the platform-portion of the pedestal by a solder layer, and the platform-portion of the pedestal is temporarily heatable by a removable heat-source to soften the solder layer for aligning the element-holding member on the platform-portion of the pedestal, and wherein the removable heat-source is an electrically powered cartridge heater, and the platform-portion has a cavity therein for receiving the cartridge heater.

3. The apparatus of claim 1 , wherein, there are two-spaced apart legs and each of the legs is attached to the base-plate by a bracket extending outward therefrom.

4. The apparatus of claim 1 , wherein the material of the holding-element and the pedestal are selected to minimize thermal coefficient of expansion mismatch with the optical element.

5. The apparatus of claim 4 , wherein the optical element is a fused silica optical element and the material of the element-holding member and the pedestal is Invar.

6. The apparatus of claim 5 , wherein the base-plate is made from aluminum or an alloy thereof.

7. The apparatus of claim 4 , wherein the optical element is a calcium fluoride optical element and the material of the element-holding member and the pedestal is stainless steel.

8. The apparatus of claim 7 , wherein the base-plate is made from aluminum or an alloy thereof.

9. A method of mounting an optical element on a base-plate, comprising the steps of:

attaching the optical element fixedly to an element-holding member;

providing a pedestal for supporting the element-holding member, the pedestal having a platform-portion, the platform portion having spaced apart legs extending therefrom;

attaching the pedestal to the base-plate via the spaced apart legs;

placing the element-holding member on the platform-portion of the pedestal with a solder layer therebetween;

applying heat to the platform-portion of the pedestal sufficient to soften the solder layer;

aligning the element-holding member and the optical element therein on the platform-portion of the pedestal in the softened solder layer; and

discontinuing the application of heat to the platform-portion of the pedestal, thereby allowing the solder layer to solidify and hold the element-holding member in the alignment on the platform portion of the pedestal.

10. A method of mounting an optical element on a base-plate, comprising the steps of:

attaching the optical element fixedly to an element-holding member;

providing a pedestal for supporting the element-holding member, the pedestal having a platform-portion, the platform portion having spaced apart legs extending therefrom;

attaching the pedestal to the base-plate via the spaced apart legs;

placing the element-holding member on the platform-portion of the pedestal with a solder layer therebetween;

applying heat to the platform-portion of the pedestal sufficient to soften the solder layer;

aligning the element-holding member and the optical element therein on the platform-portion of the pedestal in the softened solder layer; and

discontinuing the application of heat to the platform-portion of the pedestal, thereby allowing the solder layer to solidify and hold the element-holding member in the alignment on the platform portion of the pedestal, wherein the heat is applied via an electrically powered heater removably inserted into the platform-portion of the pedestal.

11. A method of mounting an optical element to a base plate comprising the steps of:

attaching a pedestal to the base plate, said pedestal having a planar platform, said pedestal including a cavity for receiving a heating element;

attaching the optical element to an element holding member, the element holding member having a planar surface for mating with the platform of the pedestal;

placing the planar surface of the element holding member into abutting relationship with the platform of the pedestal with an intermediate solder layer therebetween;

inserting a heating element into the cavity of the pedestal to heat the pedestal and the solder layer an amount sufficient to permit the relative movement between the holding member and the pedestal so that optical element can be aligned; and

discontinuing the heating of the solder layer to allow the solder layer to cool and fixing the position of the holding member with respect to the pedestal.

12. A method as recited in claim 11 wherein the platform is oriented in a non-parallel plane with respect to the base plate and the planar surface of the holding member is oriented at an angle such that adjusting the position of the optical element relative to the pedestal will raise or lower the optical element with respect to the base plate.

13. A method as recited in claim 11 wherein the pedestal is U-shaped having a pair of legs that are attached to the base plate.

14. A method as recited in claim 11 further including the step of removing the heating element from the cavity after the optical element has been aligned.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT - RELEASE OF REEL/FRAME 040575/0001 Recorded Jul 1, 2022
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: COHERENT, INC.
Reel/Frame 060562/0650 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Nov 7, 2016
From: COHERENT, INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 040575/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2012
From: DIENING, ANDREAS; HARRYMAN, DONALD E.; ALLEE, EZRA
To: COHERENT, INC.
Reel/Frame 028204/0907 →
Continuity (1)
Related Publication 20130200062A1 · Aug 8, 2013