IP Library Granted Patent US 8,405,082
Granted Patent B2
US 8,405,082 · App. 13/366,988 · Granted Mar 26, 2013

Thin film transistor array substrate and manufacturing method thereof

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Quick Facts
Patent No.
US 8,405,082
App. No.
13/366,988
Granted
Mar 26, 2013
Kind
B2
Abstract

A thin film transistor array substrate includes a gate line disposed on a substrate, the gate line comprising a gate electrode including a lower film and an upper film thicker than the lower film, a gate insulating layer formed on the gate line, a semiconductor layer formed on the gate insulating layer, an ohmic contact layer formed on the semiconductor layer, a data line electrically connected to a source electrode and a drain electrode formed on the ohmic contact layer, the lower film of the gate line is in contact with the gate insulating layer at a crossing portion of the gate line and the data line and the heights of the source electrode and the drain electrode are substantially the same as or less than a height of the semiconductor layer.

Claims (20)

1. A thin film transistor array substrate comprising:

a gate line disposed on a substrate, the gate line comprising a gate electrode;

a gate insulating layer formed on the gate line;

a semiconductor layer formed on the gate insulating layer; and

a source electrode and a drain electrode formed on the semiconductor layer, and a data line electrically connected to the source electrode, the data line crossing the gate line at a crossing portion,

wherein the gate line at the crossing portion is thinner than the gate electrode.

2. The thin film transistor array substrate of claim 1 , wherein the source electrode and the drain electrode have heights substantially the same as or less than a height of the semiconductor layer.

3. The thin film transistor array substrate of claim 1 , further comprising: an ohmic contact layer formed directly on the semiconductor layer.

4. The thin film transistor array substrate of claim 3 , wherein planar shapes of the semiconductor layer and the ohmic contact layer are substantially the same as the data line, the source electrode and the drain electrode.

5. The thin film transistor array substrate of claim 1 , wherein the gate line includes a lower film and an upper film thicker than the lower film and the gate line includes the lower film and the upper film.

6. The thin film transistor array substrate of claim 5 , wherein the gate line contacts the gate insulating layer at the crossing portion.

7. The thin film transistor array substrate of claim 5 , further comprising an ohmic contact layer formed directly on the semiconductor layer,

wherein a thickness of the data line at the crossing portion of the gate line and the data line is d, a thickness of the ohmic contact layer is n, and a thickness of the upper film of the gate line is t, and d, n and t have the following relation: d+n<t.

8. The thin film transistor array substrate of claim 1 , further comprising:

a passivation layer on the data line;

a contact hole formed in the passivation layer; and

a pixel electrode electrically connected to the drain electrode through the contact hole.

9. The thin film transistor array substrate of claim 8 , wherein the passivation layer comprises at least one of an organic material and color filter material.

10. The thin film transistor array substrate of claim 8 , wherein the pixel electrode overlaps with the semiconductor layer.

11. The thin film transistor array substrate of claim 1 , the source electrode and the drain electrode overlap with the gate electrode on a sidewall of the gate electrode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029045/0860 →