MEMS device fabricated on a pre-patterned substrate
View Patent ↗A microelectromechanical systems device fabricated on a pre-patterned substrate having grooves formed therein. A lower electrode is deposited over the substrate and separated from an orthogonal upper electrode by a cavity. The upper electrode is configured to be movable to modulate light. A semi-reflective layer and a transparent material are formed over the movable upper electrode.
1. An electromechanical systems device comprising:
a substrate having a plurality of trenches in a top surface of the substrate; and
a movable electrode layer over the top surface of the substrate and in the trenches, wherein the movable electrode layer is discontinuous between inside the trenches and outside the trenches such that the movable electrode layer outside the trenches forms a plurality of movable electrodes separated from one another.
2. The electromechanical systems device of claim 1 , further including a collapsible gap formed between the top surface of the substrate and the movable electrodes.
3. The electromechanical systems device of claim 1 , further including a stationary electrode layer over the movable electrode layer, wherein the movable electrode layer and the stationary electrode layer have a first cavity therebetween.
4. The electromechanical systems device of claim 3 , wherein the substrate is formed of an opaque material, wherein the movable electrode layer includes an at least partially reflective material, and wherein the stationary electrode layer includes a partially transparent material.
5. The electromechanical systems device of claim 1 , wherein the plurality of trenches are embossed in the substrate.
6. The electromechanical systems device of claim 1 , wherein the plurality of trenches are etched into the substrate.
7. The electromechanical systems device of claim 1 , wherein the plurality of trenches are molded with the substrate.
8. The electromechanical systems device of claim 1 , wherein the electromechanical systems device is an interferometric modulator.
9. A display system including:
the electromechanical systems device of claim 1 ;
a display;
a processor that is in electrical communication with said display, said processor being configured to process image data; and
a memory device in electrical communication with said processor.
10. The display systm of claim 9 , further including:
a first controller configured to send at least one signal to said display; and
a second controller configured to send at least a portion of said image data to said first controller.
11. The display system as recited in claim 9 , further including:
an image source module configured to send said image data to said processor.
12. The display system as recited in claim 11 , wherein said image source module includes at least one of a receiver, transceiver, and transmitter.
13. The display system as recited in claim 9 , further including:
an input device configured to receive input data and to communicate said input data to said processor.
14. An electromechanical systems device comprising:
a substrate having a top surface, wherein a plurality of grooves is formed in the top surface; and
a conductive layer over the substrate and inside the grooves such that the conductive layer is discontinuous at the grooves, forming strips of the conductive layer inside the grooves and strips of the conductive layer outside the grooves, wherein the strips of the conductive layer outside the grooves form conductive lines that are isolated from the strips of the conductive layer inside the grooves.
15. The electromechanical systems device of claim 14 , wherein the conductive lines form electrodes of the electromechanical systems device.
16. The electromechanical systems device of claim 15 , wherein the electrodes form movable electrodes of the electromechanical systems device.
17. The electromechanical systems device of claim 15 , wherein the electrodes form stationary electrodes of the electromechanical systems device.
18. The electromechanical systems device of claim 15 , further including a dielectric layer within the grooves, the dielectric layer isolating the strips of the conductive layer inside the grooves from the conductive lines.
19. The electromechanical systems device of claim 14 , wherein the plurality of grooves in the top surface of the substrate are formed by at least one of embossing, stamping, ablation, molding, and mechanical imprinting.
20. The electromechanical systems device of claim 14 , wherein at least one of the grooves has a reentrant profile.
21. An electromechanical systems device, comprising
a substrate having a plurality of grooves formed therein; and
a first plurality of conducting means formed over a top surface of the substrate and a second plurality of conducting means, wherein the first plurality of conducting means and the second plurality of conducting means are insulated from each other and separated by cavities,
wherein the first plurality of conducting means are alternated with and separated by the plurality of grooves.
22. The electromechanical systems device of claim 21 , wherein the first plurality of conducting means on the top surface of the substrate are alternated with the plurality of grooves forming rows of the first conducting means on the top surface and further including conductive material within the grooves discontinuous with the rows of first conducting means.
23. The electromechanical systems device of claim 22 , wherein the second plurality of conducting means are oriented in columns orthogonally to the rows of the first conducting means.
24. The electromechanical systems device of claim 21 , wherein the first and second plurality of reflecting means are insulated from each other by a dielectric material deposited over the first plurality of conducting means and the first plurality of conducting means are stationary electrodes.
25. The electromechanical systems device of claim 21 , wherein the plurality of first conducting means are movable electrodes.