Solid-state imaging apparatus having a translucent member
View Patent ↗A solid-state imaging apparatus including an insulating structural body having a through opening, a wiring part formed on a front surface of the structural body, a solid-state imaging element which is connected to the wiring part and also is attached to the structural body so as to close the through opening, a translucent member which is opposed to the solid-state imaging element and is attached to the structural body through an adhesive inside an adhesion region R so as to close the through opening, and a solder resist film with which at least a part of the front surface of the structural body is covered, and is characterized in that a region R 0 in which the solder resist film is selectively removed is had in the adhesion region R and the removed region R 0 is filled with the adhesive.
1. A solid-state imaging apparatus comprising:
an insulating structural body formed with a through opening;
a wiring part formed on a surface of the structural body;
a solid-state imaging element connected to the wiring part and attached to the structural body so as to close the through opening;
a translucent member opposed to the solid-state imaging element so as to close the through opening and attached to the structural body through an adhesive inside an adhesion region; and
a solder resist film covering at least a part of the surface of the structural body;
wherein the adhesion region includes a region in which the solder resist film is selectively removed and the removed region is filled with the adhesive, and
a film thickness of the adhesive is constructed so as to be thicker than that of the solder resist film, and a region sandwiched in a region in which the solder resist film is removed constructs an air escape part.
2. The solid-state imaging apparatus as claimed in claim 1 , wherein a dust trap pocket is provided inside the air escape part.
3. The solid-state imaging apparatus as claimed in claim 2 , wherein a meander-shaped pattern is formed in a region in which the solder resist film is removed, constructing a dust trap pocket in the air escape part.