Measuring device mounting method and structure
View Patent ↗A measurement device ( 10 ) mounting arrangement includes a support member ( 30 ) and a sensing device ( 12 ) in a circuit housing ( 22 ). The circuit housing ( 22 ) is electrically and mechanically connected to the support member ( 30 ) through a mounting structure ( 32 ). The circuit housing ( 22 ) has a resonance frequency and the sensing device ( 12 ) has an operational resonance frequency. The sensing device ( 12 ) measures a physical parameter and provides a signal indicative thereof. An under-fill material ( 40 ) is located between the support member ( 30 ) and the circuit housing ( 22 ) for shifting the resonance frequency of the circuit housing ( 22 ) away from the operational resonance frequency of the sensing device ( 12 ).
1. A measurement device mounting arrangement comprising:
a support member;
a sensing device in a circuit housing and electrically and mechanically connected to said support member through a mounting structure, the circuit housing having a resonance frequency and the sensing device having an operational resonance frequency, the sensing device measuring a physical parameter and providing a signal indicative thereof; and
an under-fill material located between said support member and said circuit housing, the amount and location of said under-fill material being such that the resonance frequency of the circuit housing is shifted away from the operational resonance frequency of the sensing device.
2. The measurement device mounting arrangement of claim 1 wherein said under-fill material is a non-conductive material selected from the group comprising a gel adhesive, epoxy, silicon, rubber, and acrylic.
3. The measurement device mounting arrangement of claim 1 wherein said sensing circuit is a MEMS gyro.
4. The measurement device mounting arrangement of claim 3 wherein said MEMS gyro includes a Coriolis sensor that measures angular rate about an axis of sensitivity.
5. A method for mounting a measurement device comprising the steps of:
electrically and mechanically securing a sensing device in a circuit housing to a support member through a mounting structure, the circuit housing having a resonance frequency and the sensing device having an operational resonance frequency, the sensing device measuring a physical parameter and providing a signal indicative thereof;
inserting an under-fill material between the support member and the circuit housing in an amount and at a location selected so as to shift the resonance frequency of the circuit housing away from the operational resonance frequency of the sensing device.
6. The method for mounting a measurement device of claim 5 wherein said step of inserting an under-fill material includes the step of selecting the under-fill material from the group comprising a gel adhesive, epoxy, silicon, rubber, and acrylic.