HEAT DISSIPATING DEVICE
A heat dissipating device includes a chamber body, a heat sink, a pipe, a first capillary structure and N vapor channels. The chamber body has an evaporation chamber and a compensation chamber, wherein the evaporation chamber has a vapor outlet and the compensation chamber has a liquid inlet. The heat sink is disposed on an outer wall of a first side of the chamber body and at least covers the compensation chamber. The pipe is installed within the heat sink, wherein a first end of the pipe is connected to the vapor outlet and a second end of the pipe is connected to the liquid inlet. The first capillary structure is formed in the evaporation chamber. The N vapor channels are formed in the first capillary structure. The N vapor channels and the compensation chamber are isolated by the first capillary structure.
1 . A heat dissipating device comprising:
a chamber body having an evaporation chamber and a compensation chamber, the evaporation chamber having a vapor outlet, the compensation chamber having a liquid inlet;
a heat sink disposed on an outer wall of a first side of the chamber body and at least covering the compensation chamber;
a pipe installed within the heat sink, a first end of the pipe being connected to the vapor outlet, a second end of the pipe being connected to the liquid inlet;
a first capillary structure formed in the evaporation chamber; and
N vapor channels formed in the first capillary structure, the N vapor channels and the compensation chamber being isolated by the first capillary structure, N being a positive integer.
2 . The heat dissipating device of claim 1 further comprising a vapor collecting space formed in the evaporation chamber and communicating with the N vapor channels and the vapor outlet.
3 . The heat dissipating device of claim 1 , wherein M of the N vapor channels are located on an inner wall of a second side of the chamber body, M is a positive integer smaller than or equal to N, and the second side is opposite to the first side.
4 . The heat dissipating device of claim 3 , wherein P of the N vapor channels are located on an inner wall of the first side, P is a positive integer, and a sum of P and M is smaller than or equal to N.
5 . The heat dissipating device of claim 4 , wherein Q of the N vapor channels are located between the M vapor channels and the P vapor channels, Q is a positive integer, and a sum of Q, P and M is equal to N.
6 . The heat dissipating device of claim 1 , wherein a cross-section of each of the N vapor channels is rectangular, polygonal, circular or arc-shaped.
7 . The heat dissipating device of claim 1 further comprising a second capillary structure formed in the compensation chamber and located on an inner wall of a second side of the chamber body, wherein the second side is opposite to the first side.
8 . The heat dissipating device of claim 7 further comprising:
a third capillary structure formed in the compensation chamber and located on an inner wall of the first side; and
a plurality of support pillars formed in the compensation chamber and connecting the second capillary structure and the third capillary structure.
9 . The heat dissipating device of claim 8 further comprising a plurality of fourth capillary structures, each of the fourth capillary structures being formed around one of the support pillars and connecting the second capillary structure and the third capillary structure.
10 . The heat dissipating device of claim 1 , wherein a pipe diameter of the first end is larger than a pipe diameter of the second end.
11 . The heat dissipating device of claim 1 , wherein the heat sink comprises a plurality of heat dissipating fins.