Nitride semiconductor device having reduced interface leakage currents
A nitride semiconductor device includes a semiconductor multilayer formed on a substrate, a first ohmic electrode and a Schottky electrode spaced apart from each other on the semiconductor multilayer; and a passivation film covering a top of the semiconductor multilayer. The semiconductor multilayer 102 includes a first nitride semiconductor layer, a second nitride semiconductor layer, and a p-type third nitride semiconductor layer 124 sequentially formed on the substrate. The third nitride semiconductor layer contains p-type impurities, and is selectively formed between the first ohmic electrode and the Schottky electrode in contact with the Schottky electrode.
1. A nitride semiconductor device comprising:
a semiconductor multilayer including:
at least one first nitride semiconductor layer formed on a substrate,
at least one second nitride semiconductor layer formed on the first nitride semiconductor layer, and having a wider bandgap than the first nitride semiconductor layer, and
a p-type third nitride semiconductor layer selectively formed on the second nitride semiconductor layer;
a first ohmic electrode and a Schottky electrode spaced apart from each other on the semiconductor multilayer; and
a passivation film covering a top of the semiconductor multilayer, wherein
the p-type third nitride semiconductor layer is formed between the first ohmic electrode and the Schottky electrode in contact with the second nitride semiconductor layer and the Schottky electrode,
the first ohmic electrode is a cathode electrode,
the Schottky electrode is an anode electrode, and
a bottom end of the anode electrode is lower than an interface between the first nitride semiconductor layer and the second nitride semiconductor layer.
2. The nitride semiconductor device of claim 1 , wherein the Schottky electrode is in contact with at least part of an upper surface of the third nitride semiconductor layer.
3. The nitride semiconductor device of claim 1 , wherein
the second nitride semiconductor layer includes a raised portion with a greater thickness than the other portions of the second nitride semiconductor layer, and
the third nitride semiconductor layer is formed on the raised portion.
4. The nitride semiconductor device of claim 1 , further comprising:
multiple ones of the at least one first nitride semiconductor layer; and
multiple ones of the at least one second nitride semiconductor layer, wherein
the first nitride semiconductor layers and the second nitride semiconductor layers are alternately formed.
5. The nitride semiconductor device of claim 4 , wherein a bottom end of the anode electrode is lower than an interface between a lowermost one of the first nitride semiconductor layers and a lowermost one of the second nitride semiconductor layers.
6. The nitride semiconductor device of claim 1 , wherein
the anode electrode includes a plurality of anode fingers connected in parallel to each other,
the cathode electrode includes a plurality of cathode fingers connected in parallel to each other, and
the anode fingers and the cathode fingers are alternately formed.
7. The nitride semiconductor device of claim 6 , wherein the third nitride semiconductor layer surrounds each of the plurality of anode fingers.
8. The nitride semiconductor device of claim 7 , wherein the third nitride semiconductor layer discontinuously surrounds each of the plurality of anode fingers.