In-mould molding touch module and method for manufacturing the same
View Patent ↗An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
1. A method for manufacturing an in-mould molding touch module, comprising:
(a) forming a transparent touch circuit on the inner surface of a substrate, wherein the substrate has a transparent region, and the transparent touch circuit is formed corresponding to the transparent region; and
(b) molding a molding rind molded on the substrate being an in-mold injected module to contain the touch circuit forming a one-piece body, wherein the molding rind has a window thereon to expose the transparent touch circuit.
2. The method of claim 1 , wherein the transparent touch circuit is an inducing capacitive touch circuit.
3. The method of claim 1 , wherein the step (a) further comprises a step of coating the transparent conductive layer on the inner surface of the substrate in the transparent region by a vacuum sputtering method.
4. The method of claim 3 , wherein the transparent conductive layer is made of ITO.
5. The method of claim 1 , wherein the substrate is made of a plastic film.
6. The method of claim 1 , wherein the step (a) further comprises:
forming a plurality of first-axis grids and second-axis grids on the transparent region; and
forming a plurality of interlaced reticular lines on the transparent region, wherein each of the lines is formed between adjacent first-axis grids and between adjacent second-axis grids.
7. A method for manufacturing an in-mould molding touch module, comprising:
(a) forming a first touch circuit on a first region of the inner surface of a substrate, wherein the first touch circuit is a transparent touch circuit, the first region of the substrate is a transparent region, and the transparent touch circuit is formed corresponding to the transparent region;
(b) forming a second touch circuit on a second region of the inner surface of the substrate; and
(c) molding a molding rind molded on the substrate being an in-mold injected module to contain the first touch circuit and the second touch circuit forming a one-piece body, wherein the molding rind has a window thereon to expose the transparent touch circuit.
8. The method of claim 7 , wherein the substrate is made of a plastic film.
9. The method of claim 7 , wherein the first touch circuit is an inducing capacitive touch circuit.
10. The method of claim 7 , wherein the second touch circuit is a press touch circuit, and the in-mould molding touch module further comprises a plurality of touch members corresponding to the press touch circuit.
11. The method of claim 7 , wherein the step (a) further comprises:
forming a plurality of first-axis grids and second-axis grids on the transparent region and
forming a plurality of interlaced reticular lines on the transparent region, wherein each of the lines is formed between adjacent first-axis grids and between adjacent second-axis grids.
12. The method of claim 11 , wherein the step (b) further comprises:
coating a conductive ink on the second region of the substrate, and
patterning the conductive ink to from the second touch circuit, wherein the second touch circuit is a press touch circuit.