IP Library Granted Patent US 8,876,351
Granted Patent B2
US 8,876,351 · App. 13/372,511 · Granted Nov 4, 2014

Light emitting diode lamp having heat dissipation module

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Quick Facts
Patent No.
US 8,876,351
App. No.
13/372,511
Granted
Nov 4, 2014
Kind
B2
Abstract

A light emitting diode (LED) lamp includes a heat dissipation module, a circular light guide plate (LGP), and LED light sources. The heat dissipation module includes a heat dissipation element and a heat-conducting base that has a containing concave. The heat dissipation element connecting and surrounding the heat-conducting base is distant from the circumference of the heat-conducting base. The circular LGP in the containing concave has a top surface, a bottom surface, and an annular side surface. The top surface faces the heat-conducting base and has concentric annular trenches. The LED light sources are configured in the containing concave and face the annular side surface. The LED light sources are suitable for emitting a light beam which is capable of passing through the annular side surface to enter the circular LGP and capable of being reflected by the annular trenches and emitted from the bottom surface.

Claims (20)

1. A light emitting diode lamp comprising:

a heat dissipation module comprising:

a heat-conducting base having a containing concave; and

a heat dissipation element having a connection portion and a surround portion, the surround portion connecting the heat-conducting base via the connection portion, the heat dissipation element surrounding a circumference of the heat-conducting base, and a distance being between the surround portion and the heat-conducting base;

a circular light guide plate configured in the containing concave and having a top surface, a bottom surface, and an annular side surface connecting the top surface and the bottom surface, the top surface facing the heat-conducting base and having a plurality of concentric annular trenches, wherein a trench shape of each of the concentric annular trenches on a cross section surface passing through the center of the circular light guide plate and perpendicular to the top surface is symmetrical; and

a plurality of light emitting diode light sources configured in the containing concave and facing the annular side surface of the circular light guide plate, the light emitting diode light sources being capable of emitting a light beam, the light beam being capable of passing through the annular side surface to enter the circular light guide plate and capable of being reflected by the annular trenches and emitted from the bottom surface.

2. The light emitting diode lamp as recited in claim 1 , further comprising:

a flexible circuit board configured in the containing concave and surrounding the circular light guide plate, the light emitting diode light sources being configured on the flexible circuit board.

3. The light emitting diode lamp as recited in claim 2 , the heat dissipation module further comprising:

a heat-conducting film configured between an inner wall of the containing concave and the flexible circuit board.

4. The light emitting diode lamp as recited in claim 1 , further comprising:

a cover configured on the heat-conducting base and covering the light emitting diode light sources, the cover having an opening, the opening exposing the bottom surface of the circular light guide plate.

5. The light emitting diode lamp as recited in claim 4 , one surface of the cover facing the heat-conducting base having a plurality of reflective bumps, each of the reflective bumps being extended between an inner wall of the containing concave and the annular side surface.

6. The light emitting diode lamp as recited in claim 5 , further comprising:

a flexible circuit board configured in the containing concave and surrounding the circular light guide plate, the light emitting diode light sources being configured on the flexible circuit board, the reflective bumps and the light emitting diode light sources being alternately interlaced.

7. The light emitting diode lamp as recited in claim 1 , wherein a depth of the annular trenches decreases from a center of the circular light guide plate to the annular side surface.

8. The light emitting diode lamp as recited in claim 1 , wherein the top surface of the circular light guide plate has a reflective layer.

9. The light emitting diode lamp as recited in claim 1 , wherein the circumference of the heat-conducting base has a plurality of concaves, the number of the connection portion is plural, and the connection portions are respectively inserted into the concaves.

10. The light emitting diode lamp as recited in claim 9 , wherein a length of each of the connection portions is greater than a depth of each of the concaves.

11. The light emitting diode lamp as recited in claim 1 , wherein the heat dissipation element is formed by punching.

Assignments (2)
MERGER Recorded Jan 9, 2019
From: YOUNG LIGHTING TECHNOLOGY INC.
To: CORETRONIC CORPORATION
Reel/Frame 048039/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2012
From: WEI, CHIA-HUNG; LIN, SHENG-HUNG; HWANG, JUNG-MIN
To: YOUNG LIGHTING TECHNOLOGY INC.
Reel/Frame 027704/0517 →