Molding compound on the basis of a copolyamide containing terephthalic acid and trimethylhexamethylene diamine units
View Patent ↗A molding compound, containing at least 30% by weight of a copolyamide, which is derived from the following monomers: a) 50 to 95 mole percent of the combination of a diamine, selected from the group consisting of 1,9-nonane diamine, 1,10-decane diamine, 1,11-undecane diamine and 1,12-dodecane diamine, and terephthalic acid, and b) 5 to 50 mole percent of the combination of a diamine, selected from the group consisting of 2,2,4-trimethylhexamethylene diamine, 2,4,4-trimethylhexamethylene diamine, and mixtures thereof, and terephthalic acid. The copolyamide is crystalline and has low water absorption.
1. A molding composition comprising at least 30% by weight, based on the weight of the composition, of a copolyamide, the copolyamide comprising, in reacted form
a) 50 to 95 mol % of a first mixture consisting of terephthalic acid and one diamine selected from the group consisting of 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine and 1,12-dodecanediamine, and
b) 5 to 50 mol % of a second mixture consisting of terephthalic acid and at least one diamine selected from the group consisting of 2,2,4-trimethylhexamethylenediamine and 2,4,4-trimethylhexamethylenediamine,
where the mol % values are based on the entirety of components a) and b), and at most 5 mol % of units which derive from one or more other monomers selected from the group consisting of an acid other than terephthalic acid, a lactam and an aminocarboxylic acid.
2. The composition of claim 1 , consisting of the copolyamide.
3. The composition of claim 1 , further comprising at least 0.1% by weight, based on the weight of the composition, of one or more additives.
4. The composition of claim 1 , wherein the composition is a powder.
5. A molding comprising the molding composition of claim 1 .
6. A foil comprising the molding composition of claim 1 .
7. A filament comprising the molding composition of claim 1 .
8. A fiber composite material comprising the molding composition of claim 1 .
9. The composition of claim 1 , comprising at least 40% by weight of the copolyamide, based on the weight of the composition.
10. The composition of claim 1 , comprising at least 50% by weight of the copolyamide, based on the weight of the composition.
11. The composition of claim 1 , comprising at least 60% by weight of the copolyamide, based on the weight of the composition.
12. The composition of claim 1 , wherein the copolyamide comprises, in reacted form, 55 to 90% of component (a), and 10 to 45% of the second mixture, based on the entirety of components a) and b).
13. The composition of claim 1 , wherein the copolyamide comprises, in reacted form, 60 to 85% of the first mixture, and 15 to 40% of mixture component (a), based on the entirety of components a) and b).
14. The molding composition of claim 1 , wherein the copolyamide comprises, in reacted form, the monomers of the first mixture in an amount of 85-95 mol %.
15. A molding composition comprising at least 30% by weight, based on the weight of the composition, of a copolyamide, the copolyamide comprising, in reacted form in a 1:1 molar ratio of diamine:terephthalic acid, wherein
a) 50 to 60 mol % of a first diamine is selected from the group consisting of 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine and 1,12-dodecanediamine, and
b) 40 to 50 mol % of a second diamine is selected from the group consisting of 2,2,4-trimethylhexamethylenediamine and 2,4,4-trimethylhexamethylenediamine,
where the mol % values are based on the entirety of the terephthalic acid and the components a) and b) and at most 5 mol % of one or more other monomers, wherein the molding composition does not comprise 4,4′-diaminodicyclohexylaminemethane.
16. The molding composition of claim 1 , having a melting point of from 251° C. to 282° C.
17. The molding composition of claim 1 , having an enthalphy of fusion of from 52 to 64 J/g.
18. A molding composition comprising at least 30% by weight, based on the weight of the composition, of a copolyamide, the copolyamide comprising, in reacted form
a) 50 to 95 mol % of a first mixture consisting of terephthalic acid and one diamine selected from the group consisting of 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine and 1,12-dodecanediamine, and
b) 5 to 50 mol % of a second mixture consisting of terephthalic acid and at least one diamine selected from the group consisting of 2,2,4-trimethylhexamethylenediamine and 2,4,4-trimethylhexamethylenediamine,
where the mol % values are based on the entirety of components a) and b), and at most 5 mol % of one or more other monomers selected from the group consisting of an acid other than terephthalic acid, a lactam and an aminocarboxylic acid
wherein the copolyamide has a melting temperature of from 250 to 290° C. and an enthalpy of fusion of 52 to 62 J/g.
19. A molding composition comprising at least 30% by weight, based on the weight of the composition, of a copolyamide, the copolyamide comprising, in reacted form in a 1:1 molar ratio of to diamine:terephthalic acid, wherein
a) 50 to 60 mol % of a first diamine is selected from the group consisting of 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine and 1,12-dodecanediamine, and
b) 40 to 50 mol % of a second diamine is selected from the group consisting of 2,2,4-trimethylhexamethylenediamine and 2,4,4-trimethylhexamethylenediamine,
where the mol % values are based on the entirety of the terephthalic acid and the components a) and b), and at most 5 mol % of one or more other monomers, wherein the molding composition does not comprise 4,4′-diaminodicyclohexylaminemethane,
wherein the copolyamide has a melting temperature of from 250 to 290° C. and an enthalpy of fusion of 52 to 62 J/g.
20. The molding composition of claim 18 , wherein a proportion of trimethylhexamethylenediamine monomer units in the copolyamide is within the range of 6-15 mol %.