Dual-frequency ultrasound transducer
View Patent ↗A dual-frequency ultrasound transducer, comprising a piezo-electric element bonded to a substrate, has two resonant vibration modes: a low frequency mechanical bending resonance mode and a relatively high frequency thickness resonance mode. The low frequency bending resonance mode occurs when the piezo-electric element is excited, in use, by a voltage which includes a low frequency oscillating component. The high frequency thickness resonance mode occurs when the piezo-electric element is excited, in use, by a voltage which includes a relatively high frequency oscillating component. The transducer may include a mounting arrangement, such as a support ring securing the periphery of the substrate to an underlying base layer that enhances the depth of penetration and focus of the ultrasound.
1. A dual-frequency ultrasound transducer, comprising:
a substrate;
a single piezo-electric element bonded to the substrate, wherein the diameter of the substrate is greater than the diameter of the piezo-electric element;
wherein the transducer has a low frequency mechanical bending resonance mode when the piezo-electric element is excited, in use, by a voltage which includes a low frequency oscillating component in the range of 20 kHz to 500 kHz;
wherein the transducer has a high frequency thickness resonance mode when the piezo-electric element is excited, in use, by a voltage which includes a high frequency oscillating component in the range of 500 kHz to 5 MHz; and
wherein a combined thickness of the substrate and the piezo-electric element is determined on the basis of a desired high resonant frequency in the range of 500 kHz to 5 MHz, and wherein the diameters of the piezo-electric element and the substrate are determined on the basis of the combined thickness and a desired low resonant frequency in the range of 20 kHz to 500 kHz.
2. The transducer of claim 1 , wherein the piezo-electric element is recessed in from the edge of the substrate.
3. The transducer of claim 1 , wherein the piezo-electric element is a planar disc.
4. The transducer of claim 3 , wherein the substrate is a planar disc.
5. The transducer of claim 1 , further comprising a base layer on which the substrate is supported, the outer edge of the substrate being bent away and out of contact from the base layer.
6. The transducer of claim 1 , further comprising a base layer and a support structure, wherein the peripheral edge of the substrate is clamped between the support structure and the base layer.
7. The transducer of claim 6 , wherein the support structure includes an inward facing recess into which the peripheral edge of the substrate is received so as to restrict displacement and rotation of the substrate at said peripheral edge.
8. The transducer of claim 6 , wherein the support structure includes a pointed bottom surface that constrains displacement of the substrate and allows rotation of the substrate and wherein the transducer's first and only nodal diameter is at the outer edge of the transducer.
9. The transducer of claim 1 , wherein the substrate is profiled to form a recess in which the peizo-electric element is received.
10. The transducer of claim 1 , wherein the substrate is metal.
11. A patch comprising a plurality of the transducers of claim 1 arranged in an array.
12. The transducer of claim 1 , wherein the diameters are at least 5 times the combined thickness of the substrate and the piezo-element.
13. The transducer of claim 1 , wherein the substrate is made of a material selected to maximize performance of the transducer at the desired low resonant frequency.
14. The transducer of claim 1 , wherein the substrate and the piezo-electric element are each made of a material and a thickness according to the equation:
Y 1 h 1 2 =Y 2 h 2 2 ,
where Y 1 is a stiffness of the peizo-electric element, Y 2 is a stiffness of the substrate, h 1 is the thickness of the peizo-electric element and h 2 is the thickness of the substrate.
15. A system comprising the patch of claim 11 and a gel pad configured to be disposed between the patch and skin under treatment.
16. The system of claim 15 , wherein the piezo-electric element is recessed in from the edge of the substrate.
17. The system of claim 15 , wherein the piezo-electric element is a planar disc.
18. The system of claim 17 , wherein the substrate is a planar disc.
19. The system of claim 15 , wherein each of the transducers in the array further comprises a base layer on which the substrate is supported, the outer edge of the substrate being bent away and out of contact from the base layer.
20. The system of claim 15 , wherein each of the transducers in the array further comprises a base layer and a support structure, wherein the peripheral edge of the substrate is clamped between the support structure and the base layer.
21. The system of claim 20 , wherein the support structure includes an inward facing recess into which the peripheral edge of the substrate is received so as to restrict displacement and rotation of the substrate at said peripheral edge.
22. The system of claim 20 , wherein the support structure includes a pointed bottom surface that constrains displacement of the substrate and allows rotation of the substrate and wherein the transducer's first and only nodal diameter is at the outer edge of the transducer.
23. The system of claim 15 , wherein the substrate is profiled to form a recess in which the peizo-electric element is received.
24. The system of claim 15 , wherein the substrate is metal.