Luminous device having a flexible printed circuit board
View Patent ↗A lighting device ( 1;15 ) comprising at least one flexible printed circuit board ( 3 ) which is populated with at least one semiconductor light source, comprising a potting material overlaid on at least one populated side of the printed circuit board so as to leave at least one emission surface of the semiconductor light source ( 2 ) exposed; an adhesive element at least partially covering a top side of the semiconductor light source, wherein the adhesive element ( 7 ) protrudes partially from the potting compound ( 10 ), is enclosed around its sides by the potting compound ( 10 ) in an adhesive manner and has better adhesion to the potting compound ( 10 ) than does the semiconductor light source.
1. A lighting device comprising at least one flexible printed circuit board which is populated with at least one semiconductor light source, comprising:
a potting material overlaid on at least one populated side of the printed circuit board so as to leave at least one emission surface of the semiconductor light source exposed; and
an adhesive element at least partially covering a top side of the semiconductor light source, wherein the adhesive element protrudes partially from the potting compound, is enclosed around its sides by the potting compound in an adhesive manner and has better adhesion to the potting compound than does the semiconductor light source.
2. The lighting device as claimed in claim 1 , wherein the adhesive element completely covers a top side of the respective semiconductor light source.
3. The lighting device as claimed in claim 1 , wherein the adhesive element has a lateral protrusion that is covered by the potting compound.
4. The lighting device as claimed in claim 1 , wherein the adhesive element covers the sides of the respective semiconductor light source at least partially with respect to the potting compound.
5. The lighting device as claimed in claim 3 , wherein the adhesive element has a circumferential protrusion that is bent upward.
6. The lighting device as claimed in claim 4 , wherein a wall thickness of a region of the adhesive element covering the sides of the respective semiconductor light source equals 0.2 mm to 1 mm at least in most places.
7. The lighting device as claimed in claim 1 , wherein the adhesive element includes an optical element, which is located downstream of the semiconductor light source in the optical path.
8. The lighting device as claimed in claim 7 , wherein the optical element is connected to the semiconductor light source by an index-matching material.
9. The lighting device as claimed in claim 7 , wherein a material of the optical element includes Makrolon, silicone and/or glass.
10. The lighting device as claimed in claim 1 , wherein the potting compound includes a hot melt adhesive.
11. A method for fabricating a lighting device as claimed in claim 1 , wherein the method comprises the steps of:
pressing together at least one adhesive element and a respective semiconductor light source attached to the printed circuit board; and
encapsulation of the populated printed circuit board and the at least one adhesive element.
12. The method as claimed in claim 11 , which beforehand comprises the step of inserting at least one adhesive element into a tool.
13. The method as claimed in claim 11 , which additionally comprises the step of placing at least one adhesive element onto an associated semiconductor light source.
14. The lighting device as claimed in claim 1 , wherein the adhesive element completely covers the sides of the respective semiconductor light source with respect to the potting compound.
15. The lighting device as claimed in claim 7 , wherein the optical element is a lens.