Electrically pumped optoelectronic semiconductor chip
View Patent ↗An electrically pumped optoelectronic semiconductor chip includes at least two radiation-active quantum wells comprising InGaN or consisting thereof. The optoelectronic semiconductor chip includes at least two cover layers which include AlGaN or consist thereof. Each of the cover layers is assigned to precisely one of the radiation-active quantum wells. The cover layers are each located on a p-side of the associated radiation-active quantum well. The distance between the radiation-active quantum well and the associated cover layer is at most 1.5 nm.
1. An electrically pumped optoelectronic semiconductor chip comprising:
at least two radiation-active quantum wells comprising InGaN or consisting thereof, and
at least two cover layers comprising AlGaN or consisting thereof,
wherein
each of the cover layers is assigned to precisely one of the radiation-active quantum wells,
the cover layers are each located on a p-side of the radiation-active quantum wells, and
a distance between the radiation-active quantum wells and the associated cover layers is at most 1.5 nm.
2. The optoelectronic semiconductor chip according to claim 1 , in which a layer sequence is repeated three to twenty times,
wherein
adjacent layer sequences succeed one another directly, and
the layer sequence consists of layers succeeding one another directly in the order listed:
the radiation-active quantum well,
an interlayer with or of GaN,
the cover layer and
a barrier layer which comprises GaN or consists thereof,
and
in addition, the thickness of the cover layers is 0.5 nm to 1.0 nm and the interlayers have a thickness of 0.4 nm to 0.8 nm and the distance between two cover layers succeeding one another in the direction of growth is 4 nm to 6 nm.
3. The optoelectronic semiconductor chip according to claim 1 , wherein Al content of the cover layers is 20% to 70%.
4. The optoelectronic semiconductor chip according to claim 1 , wherein thickness or average thickness of the cover layers is 0.3 nm to 1.5 nm.
5. The optoelectronic semiconductor chip according to claim 1 , which comprises at least two interlayers comprising GaN or consisting thereof and which are respectively located between the cover layers and the in each case associated radiation-active quantum wells.
6. The optoelectronic semiconductor chip according to claim 5 , wherein the interlayers have a thickness of 0.3 nm to 1.2 nm and the Al content of the cover layers is 40% to 70%.
7. The optoelectronic semiconductor chip according to claim 5 , wherein a transition region between the radiation-active quantum wells and the interlayers has a thickness of one to three monolayers.
8. The optoelectronic semiconductor chip according to claim 5 , wherein the average band gap of the interlayers in each case is at least 120% of the average band gap of an associated radiation-active quantum wells.
9. The optoelectronic semiconductor chip according to claim 1 , further comprising a transition region between the radiation-active quantum wells and the cover layers and has a thickness of one to three monolayers.
10. The optoelectronic semiconductor chip according to claim 1 , wherein distance between the radiation-active quantum wells and the in each case associated cover layers is at most two monolayers and in which the Al content of the cover layers is 20% to 50%.
11. The optoelectronic semiconductor chip according to claim 1 , which comprises 3 to 20 radiation-active quantum wells.
12. The optoelectronic semiconductor chip according to claim 1 , wherein distance between two cover layers succeeding one another in the direction of growth is 3 nm to 8 nm.
13. An optoelectronic semiconductor chip according to claim 1 , wherein a band gap of the radiation-active quantum wells is 2.55 eV to 3.0 eV.
14. The optoelectronic semiconductor chip according to claim 1 , wherein at least two adjacent radiation-active quantum wells exhibit different average band gaps and the difference is 0.03 eV to 0.20 eV.
15. An electrically pumped optoelectronic semiconductor chip comprising:
at least two radiation-active quantum wells comprising InGaN or consisting thereof,
at least two cover layers comprising AlGaN or consisting thereof, and
at least two interlayers comprising GaN or consisting thereof and wherein one of said interlayers is located in each case between one of the cover layers and the radiation-active quantum well associated with said cover layer,
wherein
each of the cover layers is assigned to precisely one of the radiation-active quantum wells,
the cover layers are each located on a p-side of the radiation-active quantum wells, and
a distance between the radiation-active quantum wells and the associated cover layers is at most 1.5 nm,
the interlayers have a thickness of 0.3 nm to 1.2 nm and Al content of the cover layers is 40% to 70%.