P-contact and light-emitting diode for the ultraviolet spectral range
The present invention relates to a p-doped contact for use in a light-emitting diode for the ultraviolet spectral range, comprising a p-contact layer having a first surface for contacting a radiation zone and a second surface comprising, on the side facing away from the first surface: a) a coating, which directly contacts 5%-99.99% of the second surface of the p-contact layer and contains or consists of a material having a maximum reflectivity of at least 60% for light with a wavelength of 200 nm to 400 nm; b) a plurality of p-injectors, which are disposed directly on the second surface of the p-contact layer.
1. A p-doped contact for use in a light-emitting diode for the ultraviolet spectral range, the p-doped contact comprising:
a p-contact layer comprising AlGaN and having a first surface for contacting a radiation zone, and a second surface opposite the first surface;
a coating covering 75%-96% of the second surface of the p-contact layer, the coating comprising a material having a maximum reflectivity of at least 60% for light in a UV range with a wavelength of 200 nm to 400 nm; and
a plurality of p-injectors arranged on the second surface of the p-contact layer, the p-injectors comprising a p-injector metal layer and at least one other p-injector layer in direct contact with the p-injector metal layer, the at least one other p-injector layer comprising p-GaN or p-(In)GaN.
2. The p-doped contact according to claim 1 , wherein the coating is electrically conductive.
3. The p-doped contact according to claim 1 , wherein the coating further covers one or more p-injectors of the p-doped contact.
4. The p-doped contact according to claim 1 , wherein the coating comprises Al.
5. The p-doped contact according to claim 1 , wherein the p-injectors comprise at least one p-injector metal layer, which enables an ohmic connection of the p-contact layer with a current source.
6. The p-doped contact according to claim 1 , wherein the p-injectors comprise a p-injector metal layer comprising at least one of Au, Ni, Pd, Pt, Rh, Ti, Ni/Au, Pd/Ti/Au, Pd/Pt/Au or Pt/Ti/Au.
7. The p-doped contact according to claim 1 , wherein the p-contact layer comprises one or more different semiconductor layers.
8. The p-doped contact according to claim 1 , wherein the p-contact layer further comprises a semiconductor layer, which forms the second surface of the p-contact layer and to which the p-injectors are applied, comprising p-doped AlGaN.
9. The p-doped contact according to claim 1 , wherein the p-injectors have a maximum width D of 10 nm to 50 μm.
10. The p-doped contact according to claim 1 , wherein the p-injectors are spaced a distance A of 20 nm to 20 μm away from their respectively adjacent p-injectors.
11. The p-doped contact according to claim 1 , wherein distances A between the p-injectors and their respective adjacent p-injectors are identical for all p-injectors.
12. The p-doped contact according to claim 1 , wherein the p-injectors have a maximum width D, the p-injectors are spaced at a distance A, and D and A are selected in such a way that a ratio D to A is between 1:1 and 1:4.
13. The p-doped contact according to claim 1 , wherein the p-injectors are arranged in a uniform pattern on the second surface of the p-contact layer.
14. A light-emitting diode comprising a radiation zone, which is arranged between an n-doped contact and the p-doped contact according to claim 1 .
15. The light-emitting diode according to claim 14 , wherein the light-emitting diode is configured to emit light in the UV range of 200 nm to 400 nm.
16. The light-emitting diode according to claim 15 , wherein the light emitting diode is configured to emit light in at least one of a UV-A range, a UV-B range, or a UV-C range.
17. The p-doped contact according to claim 1 , wherein the at least one other p-injector layer consists of p-GaN or p-(In)GaN.
18. The p-doped contact according to claim 1 , wherein the at least one other p-injector layer has a cross section that substantially matches that of the p-injector metal layer in a plane parallel to a surface of the p-contact layer.