Organic component and method for the production thereof
View Patent ↗A device comprising: a first substrate ( 1 ); a second substrate; at least one optoelectronic component ( 4 ) containing at least one organic material is arranged on the first substrate; the first substrate ( 1 ) and the second substrate ( 2 ) being arranged relative to one another in such a way that the optoelectronic component ( 4 ) is arranged between the first substrate ( 1 ) and the second substrate; a bonding material ( 3 ) is arranged between the first substrate ( 1 ) and the second substrate ( 2 ), said bonding material enclosing the optoelectronic component ( 4 ) in a frame type fashion and mechanically connecting the first and second substrates ( 1, 2 ) to one another; and wherein the bonding material ( 3 ) was softened by an exothermic chemical process of a reactive material ( 7 ) for mechanically connecting the substrates ( 1, 2 ).
1. A device comprising: a first substrate; a second substrate; at least one optoelectronic component containing at least one organic material arranged on the first substrate; the first substrate and the second substrate being arranged relative to one another in such a way that the optoelectronic component is arranged between the first substrate and the second substrate; a bonding material arranged between the first substrate and the second substrate, said bonding material enclosing the optoelectronic component in a frame type fashion and mechanically connecting the first and second substrates to one another; and wherein the bonding material was softened by an exothermic chemical process of a reactive material for mechanically connecting the substrates, and prior to the exothermic chemical process, the reactive material is introduced into the bonding material and is distributed homogeneously in the bonding material.
2. The device according to claim 1 , wherein the first substrate and/or the second substrate are/is a glass substrate.
3. The device according to claim 1 , wherein the bonding material comprises a glass frit.
4. The device according to claim 1 , wherein the bonding material comprises a glass solder.
5. The device according to claim 1 , wherein the optoelectronic component is an organic light emitting diode.
6. A method for producing a device comprising the steps of: providing a first substrate on which is arranged at least one optoelectronic component containing at least one organic material; providing a second substrate; arranging a bonding material on the first or second substrate in a frame type fashion, wherein the bonding material was softened by an exothermic chemical process of a reactive material for mechanically connecting the substrates, and prior to the exothermic chemical process, the reactive material is introduced in the bonding material and is distributed homogeneously in the bonding material; arranging the first substrate and the second substrate relative to one another in such a way that the optoelectronic component and the bonding material are arranged between the first substrate and the second substrate, wherein the bonding material encloses the optoelectronic component in a frame type fashion; and providing an initial ignition which triggers an exothermic chemical process of the reactive material.
7. The method according to claim 6 , wherein a device according to claim 1 is produced.
8. The method according to claim 6 , wherein after the initial ignition the exothermic process of the reactive material propagates automatically.
9. The method according to claim 6 , wherein the initial ignition is effected by means of a spark or a laser flash.
10. The method according to claim 6 , wherein the bonding material is temporarily heated by means of the chemical process, such that the bonding material is softened, and the first substrate and the second substrate are mechanically connected to one another.
11. A device comprising: a first substrate; a second substrate; at least one optoelectronic component containing at least one organic material arranged on the first substrate; the first substrate and the second substrate being arranged relative to one another in such a way that the optoelectronic component is arranged between the first substrate and the second substrate, wherein the first substrate has a larger base area than the second substrate, and the first substrate projects beyond the second substrate laterally in a plan view of the second substrate; a bonding material arranged between the first substrate and the second substrate, said bonding material enclosing the optoelectronic component in a frame type fashion and mechanically connecting the first and second substrates to one another; wherein the bonding material was softened by means of an exothermic chemical process of a reactive material for mechanically connecting the substrates, and prior to the exothermic chemical process, the reactive material is introduced into the bonding material and is distributed homogeneously in the bonding material, wherein the first substrate and/or the second substrate are/is a glass substrate, wherein the bonding material comprises a glass frit or a glass solder, wherein the optoelectronic component is an organic light emitting diode (OLED), and wherein the device further comprises electrical feeds of the optoelectronic component, the electrical feeds being disposed on a surface of the first substrate facing the optoelectronic component, and the electrical feeds extending out from the bonding material and projecting laterally beyond the second substrate.
12. The device according to claim 1 , wherein the bonding material comprises residues of the reactive material.