Method for producing a component with at least one organic material and component with at least one organic material
In at least one embodiment of the component ( 10 ) the latter comprises a first substrate ( 1 ) and a second substrate ( 2 ), at least one radiation-emitting or radiation-receiving element ( 3 ) being arranged on the first substrate ( 1 ), which element contains at least one organic material. The first substrate ( 1 ) and the second substrate ( 2 ) are arranged relative to one another such that the element ( 3 ) is located between the first substrate ( 1 ) and second substrate ( 2 ). The first substrate ( 1 ) and second substrate ( 2 ) are bonded together mechanically by means of a bonding agent ( 4 ) arranged in a sheet between the first substrate ( 1 ) and the second substrate ( 2 ), which bonding agent contains a glass and surrounds the element ( 3 ) with the organic material in the manner of a frame. Furthermore, the component ( 10 ) comprises a sealant ( 5 ) between the first substrate ( 1 ) and the second substrate ( 2 ), the sealant ( 5 ) surrounding and sealing the element ( 3 ) with the organic material and the bonding agent ( 4 ) in the manner of a frame.
1. A component comprising a first substrate and a second substrate, comprising:
at least one element emitting radiation and containing at least one organic material arranged on the first substrate, wherein the first substrate and the second substrate are arranged relative to one another such that the element is arranged between the first substrate and the second substrate;
a sheet of a bonding agent arranged between the first substrate and the second substrate, wherein the bonding agent contains a glass and the sheet of the bonding agent surrounds the radiation-emitting element in the manner of a frame and bonds the first substrate and the second substrate together mechanically; and
a sealant arranged between the first substrate and the second substrate, the sealant surrounding and sealing the element and the sheet of the bonding agent in the manner of a frame,
wherein the sealant extends onto outer sides of the first substrate and the second substrate remote from the element and from outer edges of the first substrate and the second substrate as far as into areas in which the bonding agent is located between the first substrate and the second substrate, so that all edges of the sealant on the first and the second substrate lie within an area in which the bonding agent has been applied to the first and the second substrate, when seen in top view,
wherein the component is an organic light-emitting diode,
wherein the sealant contains at least one of a lacquer, a silicone and a resin,
wherein the sealant has an admixture added to it, the admixture being one from the group consisting of: a filter medium, a conversion medium and a diffuser, and the sealant has a minimum thickness of 50 μm, and
wherein the surfaces of the bonding agent remote from the element and not bonded to a substrate are completely covered by the sealant.
2. The component according to claim 1 , wherein the sealant is formed with an anticorrosion agent.
3. The component according to claim 1 , wherein the sealant consists of a lacquer.
4. The component according to claim 1 , wherein at least one of the first substrate and the second substrate comprises or consists of glass.
5. The component according to claim 4 , wherein the glass is a soda-lime glass.
6. The component according to claim 1 , wherein the sealant exhibits a minimum extent of 25 μm in a direction parallel to the first substrate.
7. The component according to claim 1 , wherein the element emits radiation when in operation, and the sealant is transmissive to at least part of the radiation.
8. The component according to claim 7 , wherein the sealant completely encloses the outer surfaces, remote from the element, of the substrates and of the bonding agent, with the exception of electrical conductors for contacting the element.
9. The component according to claim 1 , wherein the distance between the first substrate and the second substrate amounts to at most 75 μm.