Infrared sensor

1. An infrared sensor comprising:

a pyroelectric element;

an IC device configured to process an output signal of said pyroelectric element; and

a surface-mounted package configured to house said pyroelectric element and said IC device, wherein

said IC device has a main surface provided with a circuit part and a rear surface opposite to said main surface,

said IC device is mounted on said bottom of said lower recessed part such that said main surface and said rear surface face said bottom of said lower recessed part and said pyroelectric element, respectively,

said package includes a package body and a package lid,

said package body comprising a substrate made of a dielectric material, a circuit wiring, and a plurality of external connection electrodes, said circuit wiring and the plurality of said external connection electrodes being made of a metal material and formed on said substrate,

said package lid being configured to transmit infrared rays to be detected by said pyroelectric element,

said package lid being bonded to said package body in a manner of enclosing with said package body said pyroelectric element and said IC device,

said package body being provided in its surface with plural recessed parts arranged in tiers,

said IC device being mounted on a bottom of a lower recessed part of said recessed parts,

said pyroelectric element being mounted on a bottom of an upper recessed part of said recessed parts closer to the surface of said package body than said lower recessed part is, so as to extend across said lower recessed part and to be away from said IC device in a thickness direction thereof,

said package body including an output wiring and a shielding member, said output wiring being configured to electrically connect an output terminal of said IC device to said external connection electrodes, said shielding member being interposed between said pyroelectric element and said output wiring, and

said IC device including a specific part adapted in use to receive at least one of a ground potential or a constant potential, and said shielding member being electrically connected to said specific part of said IC device.

2. The infrared sensor as set forth in claim 1 , wherein

said shielding member comprises a shield layer embedded in said substrate of said package body and positioned between said pyroelectric element and said output wiring, and

said shield layer being electrically connected to said specific part of said IC device adapted in use to receive the at least one of the ground potential or the constant potential.

3. The infrared sensor as set forth in claim 1 , wherein

said shielding member comprises a shield layer formed on an inner face of said substrate of said package body and positioned between said pyroelectric element and said output wiring, and

said shield layer being electrically connected to said specific part of said IC device adapted in use to receive the at least one of the ground potential or the constant potential.

4. The infrared sensor as set forth in claim 1 , wherein

said shielding member comprises a shield layer positioned between said pyroelectric element and said output wiring, said shield layer including one part embedded in said substrate of said package body and a remaining part formed on an inner face of said substrate, and

said shield layer being electrically connected to said specific part of said IC device adapted in use to receive the at least one of the ground potential or the constant potential.

5. The infrared sensor as set forth in claim 1 , wherein

said shielding member comprises a shield layer provided to said rear surface of said IC device and positioned between said pyroelectric element and said output wiring, and

said shield layer being electrically connected to said specific part of said IC device adapted in use to receive the at least one of the ground potential or the constant potential.

6. The infrared sensor as set forth in claim 1 , wherein

said shielding member comprises a shield plate interposed between said rear surface of said IC device and said pyroelectric element so as to be interposed between said pyroelectric element and said output wiring, and

said shield plate being electrically connected to said specific part of said IC device adapted in use to receive the at least one of the ground potential or the constant potential.

7. The infrared sensor as set forth in claim 6 , wherein

said shield plate is made of at least one of a metal plate or a printed board.

8. The infrared sensor as set forth in claim 1 , wherein

an outer shape of said package body is a square shape in a planar view, and

a center of said pyroelectric element is aligned with a center of said package body in the planar view.

9. The infrared sensor as set forth in claim 1 , wherein

said package lid is provided at its periphery with a stepped part for positioning said package lid relative to said package body.

10. The infrared sensor as set forth in claim 1 , wherein

said package lid is a silicon lens.

11. The infrared sensor as set forth in claim 1 , further comprising a plastic housing disposed outside said package.

12. The infrared sensor as set forth in claim 11 , wherein

said housing is mounted on said package in a manner of forming with said package an air space, excluding a part used for attaching said housing to said package.

13. The infrared sensor as set forth in claim 11 , wherein

said housing is mounted on said package by engaging an engaging recessed part provided to a side face of said package body and an engaging protruded part provided to said housing.

14. The infrared sensor as set forth in claim 1 , wherein

said pyroelectric element is made of a pyroelectric material selected from one of lithium tantalate and lithium niobate.