Conductive plastic overmold on shielded plastic window
View Patent ↗An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.
1. An integral EMI shielded window assembly comprising: an EMI-shielded window having an outer perimeter, said window comprising an electrically-conductive wire mesh laminated between adjacent glass or plastic sheets; an overmolded electrically-conductive plastic bezel providing an environmentally secure seal around the outer perimeter of the window and forming a single integral unitary structure with the window; and a busbar contacting the wire mesh and bezel providing electrical conductivity between the wire mesh and bezel, said busbar being coated with an electrically conductive coating.
2. The assembly of claim 1 wherein the electrically conductive wire mesh comprises stainless steel.
3. The assembly of claim 1 wherein the mesh is blackened.
4. The assembly of claim 1 wherein the electrically-conductive plastic comprises an electrically-conductive particulate filler.
5. The assembly of claim 1 wherein the window comprises an inner section and an outer perimeter surrounding the inner section, the inner section having a first thickness and the outer perimeter having a second thickness less than the first thickness, the bezel being molded over at least a portion of the outer perimeter.
6. An electronic device having improved EMI shielding comprising:
an enclosure for electronic components; and
the assembly of claim 1 ;
wherein said assembly is affixed to the front panel of the enclosure.