PHOTOELECTRIC CONVERTER AND METHOD FOR PRODUCING SAME
A photoelectric conversion device is provided wherein variance of photoelectric conversion efficiency within a panel plane is reduced. A method of manufacturing a photoelectric conversion device having a microcrystalline silicon photoelectric conversion unit ( 104 ) which has a layered structure including a p-type layer ( 40 ), an i-type layer ( 42 ) including a microcrystalline silicon layer which serves as a power generating layer, and an n-type layer ( 44 ) is provided, the method comprising a step of forming the i-type layer ( 42 ), wherein a first i-type layer ( 42 a ) is formed and a second i-type layer ( 42 b ) is formed over the first i-type layer ( 42 a ) under a condition that a crystallization percentage is higher than that of the first i-type layer ( 42 a ) and an in-plane distribution of the crystallization percentage is lower than that of the first i-type layer.
1 . A method of manufacturing a photoelectric conversion device having a layered structure of a p-type layer, an i-type layer including a microcrystalline silicon layer which serves as a power generating layer, and an n-type layer, the method comprising the step of:
forming the i-type layer wherein a first microcrystalline silicon layer is formed, and a second microcrystalline silicon layer is formed over the first microcrystalline silicon layer under a condition that a crystallization percentage is higher than that of the first microcrystalline silicon layer and an in-plane distribution of the crystallization percentage is smaller than that of the first microcrystalline silicon layer.
2 . The method of manufacturing the photoelectric conversion device according to claim 1 , wherein
the first microcrystalline silicon layer is formed under a condition that, when the first microcrystalline silicon layer is formed as a single film over a glass substrate, a ratio of peak heights Ic/Ia between a Raman scattering intensity Ic around 520 cm −1 in Raman spectroscopy and a Raman scattering intensity Ia around 480 cm −1 is in a range of 2˜4, and
the second microcrystalline silicon layer is formed under a condition that, when the second microcrystalline silicon layer is formed as a single film over a glass substrate, the ratio of peak heights Ic/Ia is in a range of 4˜6.
3 . The method of manufacturing the photoelectric conversion device according to claim 1 , further comprising the step of:
forming, prior to the formation of the first microcrystalline silicon layer, a buffer layer under a condition that the crystallization percentage is higher than those of the first microcrystalline silicon layer and the second microcrystalline silicon layer, and the in-plane distribution of the crystallization percentage is higher than those of the first microcrystalline silicon layer and the second microcrystalline silicon layer.
4 . The method of manufacturing the photoelectric conversion device according to claim 3 , wherein
in the buffer layer, a ratio of peak heights Ic/Ia between a Raman scattering intensity Ic around 520 cm −1 in Raman spectroscopy and a Raman scattering intensity Ia around 480 cm −1 when the buffer layer is formed as a single film over a glass substrate is greater than or equal to 10 and a thickness is greater than or equal to 40 nm, or the ratio of the peak heights Ic/Ia is greater than or equal to 13.
5 . A photoelectric conversion device having a layered structure of a p-type layer including a p-type dopant, an i-type layer including a microcrystalline silicon layer which serves as a power generating layer, and an n-type layer including an n-type dopant, wherein
the i-type layer has a layered structure of a first microcrystalline silicon layer and a second microcrystalline silicon layer formed under a condition that a crystallization percentage is higher than that of the first microcrystalline silicon layer and an in-plane distribution of the crystallization percentage is smaller than that of the first microcrystalline silicon layer.
6 . The photoelectric conversion device according to claim 5 , wherein
the first microcrystalline silicon layer has a thickness within a range of greater than or equal to 100 nm and less than or equal to 2500 nm.
7 . The photoelectric conversion device according to claim 5 , further comprising:
a buffer layer formed under a condition that the crystallization percentage is higher than those of the first microcrystalline silicon layer and the second microcrystalline silicon layer and the in-plane distribution of the crystallization percentage is higher than those of the first microcrystalline silicon layer and the second microcrystalline silicon layer, and the first microcrystalline silicon layer is formed over the buffer layer.
8 . The photoelectric conversion device according to claim 7 , wherein
in the buffer layer, a ratio of peak heights Ic/Ia between a Raman scattering intensity Ic around 520 cm −1 in Raman spectroscopy and a Raman scattering intensity Ia around 480 cm −1 when the buffer layer is formed as a single film over a glass substrate is greater than or equal to 10, and a thickness is greater than or equal to 40 nm, or the ratio of the peak heights Ic/Ia is greater than or equal to 13.